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DD175N30KHPSA1

Infineon Technologies

DD175N30KHPSA1 by Infineon Technologies

Infineon's DD175N30KHPSA1 is a rectifier diode with 2 elements, max output current of 223A, and reverse test voltage of 3000V. Ideal for high-power applications requiring efficient power conversion in industrial electronics and automotive systems. Operating temperature range from -40 to 150°C makes it suitable for various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,110 parts In-Stock

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Digiode

USA . 269 parts In-Stock

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Nova Conductors

Japan . 68 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 157 parts In-Stock

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$0.084

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157

$0.084

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Modulus Dynamics

Lithuania . 27,506 parts In-Stock

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$0.138

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$0.132

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$0.127

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Corohmni

South Africa . 37 parts In-Stock

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$0.173

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37

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Ampacity Inc.

Singapore . 1,352 parts In-Stock

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$2.010

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$2.010

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AZTECH Wire

Italy . 689 parts In-Stock

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$12.823

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Microchip USA

USA . 5,448 parts In-Stock

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$421.865

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$421.865

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Component Stockers USA

USA . 34 parts In-Stock

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$3,461.240

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34

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Continental Prestige Electronics

USA . 1,182 parts In-Stock

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Argo Parts USA

USA . 1,025 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corphita

USA . 77 parts In-Stock

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Overview

Discover the Infineon Technologies DD175N30KHPSA1, a high-quality diode & rectifier that offers unrivaled performance and reliability. With Infineon's reputation for excellence in manufacturing, this product is designed to exceed expectations in a wide range of applications. From its efficient design to its impressive output current capacity, the DD175N30KHPSA1 provides customers with unparalleled value and benefits. Whether you're looking for a reliable solution for power supplies or industrial equipment, this diode & rectifier is sure to meet your needs with its superior performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Maximum Reverse Current: 20000 uA

Allows for efficient flow of current in the reverse direction.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures without malfunctioning.

Diode Type: RECTIFIER DIODE

Designed specifically for rectifying current in electronic circuits.

Maximum Output Current: 223 A

Capable of handling high current loads effectively.

Technical Specifications

Diodes & Rectifiers DD175N30KHPSA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

2.05 V

JESD-30 Code:

R-PUFM-X3

Maximum Non Repetitive Peak Forward Current:

4.5 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

223 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Reverse Voltage:

3000 V

Maximum Reverse Current:

20000 uA

Reverse Test Voltage:

3000 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DD175N30KHPSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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