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C505CA4EMCAFXQMA1

Infineon Technologies

C505CA4EMCAFXQMA1 by Infineon Technologies

C505CA4EMCAFXQMA1 by Infineon is an 8-bit microcontroller with a 16-bit address bus, operating at up to 20 MHz. Suitable for industrial applications, it features 34 I/O lines, PWM channels, and ADC channels. With a compact square flatpack package style and a wide temperature range from -40°C to 85°C, it offers versatile performance in various environments.

Median Price

$69.888

Lifecycle Status

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Arrow

USA . 576 parts In-Stock

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$81.479

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$79.061

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$79.061

Verical

USA . 576 parts In-Stock

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$69.888

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Chip1Stop

Japan . 576 parts In-Stock

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$68.700

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$68.700

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Nova Conductors

Japan . 95 parts In-Stock

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$7.684

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Chip Stock

USA . 2,652 parts In-Stock

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Vyrian

USA . 2,567 parts In-Stock

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Digiode

USA . 615 parts In-Stock

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Cyclops Electronics Ltd

UK . 450 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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Continental Prestige Electronics

USA . 6,356 parts In-Stock

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$7.684

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$7.530

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$7.684

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Netroflash

USA . 2,000 parts In-Stock

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$7.684

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$7.300

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$7.146

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$7.684

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$7.146

AZTECH Wire

Italy . 337 parts In-Stock

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$12.030

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Corohmni

South Africa . 940 parts In-Stock

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$41.395

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$41.395

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Andel Nordic

Denmark . 2,936 parts In-Stock

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$46.370

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$32.456

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$32.456

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$32.456

Ampacity Inc.

Singapore . 545 parts In-Stock

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$57.600

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Modulus Dynamics

Lithuania . 1,710 parts In-Stock

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$68.882

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$66.127

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$63.371

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$63.371

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Aztec Data Supply Inc.

USA . 4,320 parts In-Stock

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$76.367

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Component Stockers USA

USA . 756 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 6,800 parts In-Stock

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Argo Parts USA

USA . 2,917 parts In-Stock

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Perfect Parts

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Corphita

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the C505CA4EMCAFXQMA1 by Infineon Technologies. This high-quality microcontroller offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile device delivers exceptional value and benefits to customers, ensuring seamless and efficient operation. Trust Infineon Technologies for top-of-the-line solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection to the microcontroller, making it reliable for different applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, reducing production costs and saving space on the board.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher voltage levels, making it suitable for a wide range of power supply options.

Address Bus Width: 16

A wider address bus width of 16 allows for greater memory addressing capabilities and more complex processing tasks.

Package Shape: SQUARE

Square package shape is space-efficient and allows for easy placement on the PCB, optimizing board layout and design.

Bit Size: 8

8-bit size allows for efficient processing of data and instructions, making this microcontroller suitable for a variety of embedded applications.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options for peripherals and external devices, making it versatile for different project requirements.

Package Style (Meter): FLATPACK

Flatpack design offers a low-profile package style that is ideal for compact designs and space-constrained applications.

Minimum Supply Voltage: 4.25 V

With a minimum supply voltage of 4.25V, this microcontroller can operate efficiently even at lower power levels, conserving energy and extending battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliability in varying environmental conditions and extends the product's lifespan.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows this microcontroller to function in extreme cold environments without performance degradation.

Terminal Finish: Matte Tin (Sn)

Matte Tin terminal finish provides excellent solderability and ensures strong and reliable connections for enhanced product performance.

ADC Channels: YES

Presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

Quad terminal positions offer multiple connection points for enhanced flexibility in circuit connectivity and layout design.

Maximum Seated Height: 2.45 mm

Low maximum seated height of 2.45mm allows for slim and compact device designs, ideal for space-constrained applications.

Width: 10 mm

With a width of 10mm, this microcontroller can be easily integrated into different PCB layouts and designs, offering versatility in product development.

External Data Bus Width: 8

8-bit external data bus width enables efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20MHz allows for fast data processing and execution speeds, making this microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a peak reflow temperature time of 40 seconds, this microcontroller is easy to solder and rework, streamlining production processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable and durable solder joints during the assembly process, optimizing product performance.

Length: 10 mm

Compact length of 10mm allows for space-efficient placement on the PCB, enabling compact and sleek product designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and robust solder connections, ensuring stable electrical connections for improved product reliability.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this microcontroller into existing systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels provide precise control over digital signals, enabling this microcontroller to drive motors, LEDs, and other actuators with accuracy.

ROM Programmability: OTPROM

One-Time Programmable (OTProm) ROM allows for secure and permanent storage of program code, ensuring data integrity and protection against unauthorized access.

Terminal Pitch: 0.8 mm

Terminal pitch of 0.8mm offers fine pitch connections for compact PCB designs, enabling high-density routing and minimizing signal crosstalk.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level (MSL) of 3 indicates this microcontroller can withstand standard reflow soldering processes without being affected by moisture, ensuring product reliability.

Speed: 20 rpm

Operating speed of 20 revolutions per minute (rpm) enables rapid data processing and execution, making this microcontroller suitable for high-speed applications.

No. of I/O Lines: 34

Having 34 input/output lines provides ample connectivity options for interfacing with external devices and peripherals, making this microcontroller versatile for a variety of applications.

Technical Specifications

Microcontrollers C505CA4EMCAFXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

IT CAN ALSO OPERATE AT 2V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

C505CA4EMCAFXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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