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C164CI8EMDBKXQMA1

Infineon Technologies

C164CI8EMDBKXQMA1 by Infineon Technologies

Infineon's C164CI8EMDBKXQMA1 microcontroller features 32-bit architecture, 8-bit data RAM, and 65536 ROM words. Ideal for automotive applications, it offers CAN, SPI, UART connectivity and peripherals like PWM and RTC. With a temperature range of -40 to 125°C, this CMOS technology-based chip is suitable for various automotive control systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,705 parts In-Stock

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Digiode

USA . 654 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 842 parts In-Stock

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AZTECH Wire

Italy . 376 parts In-Stock

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Semicontronic

India . 126 parts In-Stock

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Modulus Dynamics

Lithuania . 2,990 parts In-Stock

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$22.428

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$21.493

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$41.970

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Andel Nordic

Denmark . 1,209 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,938 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Corphita

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Bastille Electronics

Australia . 79 parts In-Stock

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Overview

Elevate your automotive electronics with the C164CI8EMDBKXQMA1 microcontroller by Infineon Technologies. Designed for reliability and performance, this chip offers a wide range of peripherals including PWM, RTC, and Timer(5). With CAN, SPI, and UART connectivity, it's perfect for a variety of applications. Experience the quality and innovation of Infineon Technologies with this versatile microcontroller, providing value and benefits to customers looking for top-notch automotive solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller, saving time and space on the PCB.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 bits enables the microcontroller to handle and process data efficiently.

Bit Size: 32

This microcontroller has a 32-bit architecture, which allows for higher processing capabilities and performance.

No. of Terminals: 80

With 80 terminals, this microcontroller offers a wide range of connectivity options and interfaces for peripheral devices.

CPU Family: C166

The C166 CPU family is known for its reliability and performance, making it a good choice for embedded system applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers integrated peripherals and processing capabilities in a compact package, suitable for embedded applications.

Speed: 20 rpm

Operating at a speed of 20 rpm, this microcontroller can handle tasks quickly and efficiently, making it suitable for real-time applications.

Technical Specifications

Microcontrollers C164CI8EMDBKXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

C166

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of I/O Lines:

59

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

20 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, SPI, UART

Peripherals:

PWM, RTC, TIMER(5), WDT

Trade Compliance

C164CI8EMDBKXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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