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C164CI8EMCBKXQMA1

Infineon Technologies

C164CI8EMCBKXQMA1 by Infineon Technologies

The Infineon Technologies C164CI8EMCBKXQMA1 microcontroller features 16-bit size, 22-bit address bus width, and 80 terminals. Ideal for automotive applications, it operates b/w -40 to 125°C with a clock frequency of up to 20 MHz. With PWM channels and ADC support, this CMOS technology-based device is suitable for various control systems.

Median Price

$54.486

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 336 parts In-Stock

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$55.642

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$50.599

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$50.599

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Rochester

USA . 292 parts In-Stock

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-

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$53.330

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$47.720

10k+ parts

$44.910

292

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$47.720

$44.910

Distributors (In-Stock)

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Digiode

USA . 978 parts In-Stock

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$52.859

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978

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Vyrian

USA . 11,855 parts In-Stock

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Chip Stock

USA . 3,200 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 137 parts In-Stock

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$12.230

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$12.230

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Ampacity Inc.

Singapore . 186 parts In-Stock

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$47.300

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186

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Corphita

USA . 513 parts In-Stock

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$50.077

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Corohmni

South Africa . 67 parts In-Stock

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$63.418

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67

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Modulus Dynamics

Lithuania . 2,435 parts In-Stock

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$71.192

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$68.344

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$65.497

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2,435

$71.192

$68.344

$65.497

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,452 parts In-Stock

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Argo Parts USA

USA . 2,167 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 955 parts In-Stock

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955

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Microchip USA

USA . 363 parts In-Stock

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363

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Overview

Unleash the power of innovation with the C164CI8EMCBKXQMA1 microcontroller by Infineon Technologies. Boasting top-notch quality and reliability, this dynamic device is a game-changer in the world of electronics. Perfect for automotive applications, this versatile microcontroller offers unmatched performance, increased efficiency, and seamless integration. Elevate your projects to new heights with the cutting-edge technology of the C164CI8EMCBKXQMA1. Experience the difference and unlock a world of possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easier to handle and more resistant to physical damage.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Address Bus Width: 22

A wider address bus allows for greater memory capacity and improved data processing capabilities.

Bit Size: 16

A 16-bit architecture provides improved data processing performance compared to lower bit sizes.

Maximum Clock Frequency: 20 MHz

The high clock frequency allows for fast data processing and real-time performance in applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates a CPU, memory, and I/O peripherals on a single chip, making it suitable for embedded systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

ROM Programmability: OTPROM

One-Time Programmable ROM allows for secure and permanent storage of firmware and data, ensuring data integrity and preventing unauthorized access.

Technical Specifications

Microcontrollers C164CI8EMCBKXQMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

16

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

59

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Programmability:

OTPROM

Maximum Seated Height:

2.45 mm

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

C164CI8EMCBKXQMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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