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BSP762T

Infineon Technologies

BSP762T by Infineon Technologies

BSP762T by Infineon Technologies is a Power Management IC with AEC-Q100 screening level. It operates b/w -40 to 150°C, supports supply voltages from 5V to 34V, and has a max current of 1.3mA. Ideal for power supply support circuits in automotive applications due to its small outline package and SIPMOS technology.

Median Price

$2.698

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 29,425 parts In-Stock

1+ parts

$3.450

100+ parts

$1.830

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$1.330

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$1.120

29,425

$3.450

$1.830

$1.330

$1.120

Verical

USA . 2,488 parts In-Stock

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-

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$1.945

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$1.790

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2,488

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$1.945

$1.790

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Distributors (In-Stock)

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Maritex

Poland . 5,352 parts In-Stock

1+ parts

$2.914

100+ parts

$1.548

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$1.072

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$0.968

5,352

$2.914

$1.548

$1.072

$0.968

Digiode

USA . 494 parts In-Stock

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$3.249

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TME

Poland . 862 parts In-Stock

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$1.410

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$1.370

862

$3.650

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$1.410

$1.370

Rutronik

Germany . 42,500 parts In-Stock

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Vyrian

USA . 28,516 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,369 parts In-Stock

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Sensible Micro Corp

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Component Sense

UK . 3,122 parts In-Stock

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Rebound Electronics

UK . 2,816 parts In-Stock

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VNN

France . 2,715 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Magnum Semiconductors LLP

India . 1,000 parts In-Stock

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Bristol Electronics

USA . 778 parts In-Stock

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$1.500

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$0.840

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778

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$0.840

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AGACORP

USA . 250 parts In-Stock

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Avant Electronics Limited

UK . 210 parts In-Stock

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Speed Components Ltd

Israel . 82 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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ECAB

Sweden . 6 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Elcom Components

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Classic Components Corporation

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Distributors (Availability)

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Ampacity Inc.

Singapore . 27,604 parts In-Stock

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$1.460

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$1.460

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Semicontronic

India . 27,165 parts In-Stock

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$1.460

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$1.424

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$1.416

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$1.460

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CoreStaff

Japan . 2,490 parts In-Stock

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$1.640

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$1.084

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$1.079

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$1.640

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$1.079

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Corphita

USA . 15 parts In-Stock

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$3.078

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Modulus Dynamics

Lithuania . 653 parts In-Stock

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$7.462

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$7.164

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$6.865

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653

$7.462

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$6.865

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$7.964

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$7.566

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$7.566

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Corohmni

South Africa . 1,077 parts In-Stock

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$10.383

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Perfect Parts

USA . 120,561 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,241 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Alle Elektronik GmbH

Germany . 4,827 parts In-Stock

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Continental Prestige Electronics

USA . 3,192 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Argo Parts USA

USA . 2,341 parts In-Stock

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Lixinc

USA . 1,220 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your electronic devices with the BSP762T by Infineon Technologies, a top-tier manufacturer of Power Management ICs. This small outline package offers unparalleled quality and reliability for a wide range of applications. With a nominal supply voltage of 13.5V and maximum operating temperature of 150°C, this power supply support circuit provides exceptional performance in a compact design. Trust Infineon Technologies to deliver cutting-edge technology that ensures your devices operate at their peak efficiency. Elevate your products with the BSP762T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good mechanical properties, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into circuit boards, saving time and space.

Screening Level: AEC-Q100

This screening level ensures automotive-grade reliability, making the product suitable for automotive applications.

Nominal Supply Voltage (Vsup): 13.5 V

The nominal supply voltage of 13.5 V is commonly used in automotive and industrial applications, making the product versatile.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enabling the product to support various power management functions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making the product ideal for compact designs.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes the product suitable for use in cold environments.

Technology: SIPMOS

The SIPMOS technology provides efficient power management and helps in reducing energy consumption.

Technical Specifications

Power Management ICs BSP762T attributes and parameters. Explore more Power Management ICs devices from Infineon Technologies

Specs

Additional Features:

ESD Value for IN pin is 1C

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

1.3 mA

Maximum Supply Voltage (Vsup):

34 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

SIPMOS

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4 mm

Trade Compliance

BSP762T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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