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BSL307SPH6327

Infineon Technologies

BSL307SPH6327 by Infineon Technologies

Infineon's BSL307SPH6327 is a P-CHANNEL Power FET with 30V DS Breakdown Voltage, 22A IDM, and 0.043 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,674 parts In-Stock

1+ parts

$1.080

100+ parts

$0.437

1k+ parts

$0.302

10k+ parts

$0.227

3,674

$1.080

$0.437

$0.302

$0.227

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 166 parts In-Stock

1+ parts

$0.627

100+ parts

-

1k+ parts

-

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166

$0.627

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Vyrian

USA . 462 parts In-Stock

1+ parts

$0.660

100+ parts

-

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-

10k+ parts

-

462

$0.660

-

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Connector Distribution Corp

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

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2,200

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-

-

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Right Parts Inc.

USA . 2,200 parts In-Stock

1+ parts

-

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2,200

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 887 parts In-Stock

1+ parts

$0.594

100+ parts

-

1k+ parts

-

10k+ parts

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887

$0.594

-

-

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Modulus Dynamics

Lithuania . 141 parts In-Stock

1+ parts

$1.226

100+ parts

$1.177

1k+ parts

$1.128

10k+ parts

-

141

$1.226

$1.177

$1.128

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

-

100+ parts

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90,000

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A-Z Elektronik GmbH

Germany . 20,436 parts In-Stock

1+ parts

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100+ parts

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20,436

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Lixinc

USA . 15,186 parts In-Stock

1+ parts

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15,186

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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15,000

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Alle Elektronik GmbH

Germany . 1,245 parts In-Stock

1+ parts

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1,245

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Northwest PG Solutions

USA . 1,140 parts In-Stock

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1,140

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Native Components

USA . 77 parts In-Stock

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77

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Overview

Discover the cutting-edge BSL307SPH6327 Power FET by Infineon Technologies, a game-changer in the field of electronic components. With unparalleled quality and reliability, this P-channel transistor offers a wide range of applications, from automotive to industrial electronics. Say goodbye to performance limitations with its built-in diode and impressive 30V minimum breakdown voltage. Experience enhanced efficiency and power handling with the Infineon advantage. Upgrade your device today and unlock a world of possibilities with the BSL307SPH6327.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Offers efficient current conduction in a particular direction, leading to better performance in specific applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor, saving space and reducing component count.

Surface Mount: YES

Facilitates easy and secure mounting on circuit boards, contributing to efficient assembly and reliable connections.

Minimum DS Breakdown Voltage: 30 V

Supports high voltage handling capabilities, making the transistor suitable for various power applications.

Package Shape: RECTANGULAR

A common and practical shape for easy integration into circuit layouts, enhancing compatibility and versatility.

Terminal Form: GULL WING

Enables secure soldering connections on the terminals, ensuring stable electrical contact and longevity.

Operating Mode: ENHANCEMENT MODE

Delivers improved control over current flow, enhancing the efficiency and performance of the transistor.

Maximum Pulsed Drain Current (IDM): 22 A

Handles high peak currents with reliability, making it suitable for applications requiring sudden power surges.

Avalanche Energy Rating (EAS): 44 mJ

Resists breakdown due to high energy spikes, ensuring robust protection against voltage transients and surges.

No. of Terminals: 6

Provides ample connectivity options for external circuitry, facilitating versatile integration and configurations.

Package Style (Meter): SMALL OUTLINE

Occupies minimal space on the circuit board, allowing for compact designs and efficient use of available area.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers efficient operation and low power consumption, enhancing the overall performance and energy efficiency of the transistor.

Transistor Element Material: SILICON

Ensures reliable and stable performance over a wide temperature range, making it suitable for demanding operating conditions.

Maximum Drain Current (ID): 5.5 A

Handles moderate continuous currents effectively, making it suitable for medium-power applications without overheating.

Maximum Drain-Source On Resistance: 0.043 ohm

Offers low resistance for efficient current conduction, minimizing power loss and improving overall performance.

Terminal Position: DUAL

Provides multiple connection points for flexible wiring configurations, enhancing compatibility with different circuit layouts.

Reference Standard: AEC-Q101

Complies with industry standards for quality and reliability, ensuring consistent performance and compatibility with automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) BSL307SPH6327 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

44 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

22 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

BSL307SPH6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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