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BPW34B

Infineon Technologies

BPW34B by Infineon Technologies

Infineon's BPW34B is a PIN photodiode with max. operating temp of 80°C and min. temp of -40°C. It has a max. dark current of 2nA, response time of 0.00000035s, and reverse voltage of 32V. Ideal for optoelectronic applications requiring precise light detection in various environments due to its silicon semiconductor material and through-hole mounting feature.

Median Price

$4.553

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Element14

Singapore . 23 parts In-Stock

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$4.553

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$4.094

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Digiode

USA . 160 parts In-Stock

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$4.325

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VNN

France . 9,661 parts In-Stock

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Nova Conductors

Japan . 345 parts In-Stock

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Vyrian

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Mentor Electronics Marketing, LLC

USA . 4 parts In-Stock

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Modulus Dynamics

Lithuania . 1,447 parts In-Stock

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$0.428

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$0.411

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$0.394

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Aztec Data Supply Inc.

USA . 890 parts In-Stock

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$0.640

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$0.640

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Semicontronic

India . 21 parts In-Stock

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$3.870

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$3.773

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$3.754

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Corphita

USA . 825 parts In-Stock

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$4.098

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AZTECH Wire

Italy . 687 parts In-Stock

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$7.514

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Ampacity Inc.

Singapore . 21 parts In-Stock

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$8.420

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Continental Prestige Electronics

USA . 8,711 parts In-Stock

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Argo Parts USA

USA . 8,026 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 5,421 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Bastille Electronics

Australia . 850 parts In-Stock

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Corohmni

South Africa . 747 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 23 parts In-Stock

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Overview

Experience the superior quality and reliability of the BPW34B photodiode by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers cutting-edge optoelectronic solutions for a wide range of applications. The BPW34B offers unparalleled value with its high-performance capabilities, making it ideal for use in light detection, remote control systems, and medical equipment. Trust Infineon to provide you with the best-in-class photodiodes that exceed your expectations.

Feature Benefit Bullets

Optoelectronic Type: PIN PHOTODIODE

PIN photodiodes offer high sensitivity and low capacitance, making them ideal for precision light detection applications.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the photodiode can function effectively even in harsh cold conditions.

Maximum Dark Current: 2 nA

The low dark current minimizes noise and improves the signal-to-noise ratio of the photodiode output.

Maximum Response Time: 0.00000035 s

The extremely fast response time allows for accurate detection of rapid changes in light intensity.

Maximum Reverse Voltage: 32 V

The high maximum reverse voltage rating provides protection against reverse bias conditions, increasing the photodiode's reliability.

Semiconductor Material: Silicon

Silicon photodiodes offer high quantum efficiency and low dark current, making them a popular choice for many light sensing applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mount design simplifies installation and ensures secure mounting of the photodiode in a variety of electronic devices.

Technical Specifications

Photodiodes BPW34B attributes and parameters. Explore more Photodiodes devices from Infineon Technologies

Specs

Maximum Dark Current:

2 nA

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Response Time:

.00000035 s

Maximum Reverse Voltage:

32 V

Semiconductor Material:

Silicon

Sub-Category:

Photo Diodes

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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