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BCR410WH6327XTSA1

Infineon Technologies

BCR410WH6327XTSA1 by Infineon Technologies

Infineon's BCR410WH6327XTSA1 is a small outline, very thin profile analog circuit with 4 terminals. It operates at a nominal voltage of 3V and has a max seated height of 1mm. This semiconductor is designed for surface mount applications in various electronic devices.

Median Price

$0.076

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

33,000

-

$0.079

$0.066

$0.059

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.073

33,000

-

-

-

$0.073

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 550 parts In-Stock

1+ parts

$0.062

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$0.062

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.064

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.064

-

-

-

Vyrian

USA . 6,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,945

-

-

-

-

VNN

France . 2,748 parts In-Stock

1+ parts

-

100+ parts

-

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2,748

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 32,801 parts In-Stock

1+ parts

$0.055

100+ parts

$0.054

1k+ parts

$0.053

10k+ parts

-

32,801

$0.055

$0.054

$0.053

-

Ampacity Inc.

Singapore . 32,623 parts In-Stock

1+ parts

$0.055

100+ parts

-

1k+ parts

-

10k+ parts

-

32,623

$0.055

-

-

-

Corphita

USA . 83 parts In-Stock

1+ parts

$0.058

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$0.058

-

-

-

Continental Prestige Electronics

USA . 1,578 parts In-Stock

1+ parts

$0.064

100+ parts

-

1k+ parts

-

10k+ parts

$0.062

1,578

$0.064

-

-

$0.062

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.064

100+ parts

$0.062

1k+ parts

-

10k+ parts

-

1,000

$0.064

$0.062

-

-

Argo Parts USA

USA . 5 parts In-Stock

1+ parts

$0.064

100+ parts

-

1k+ parts

-

10k+ parts

$0.062

5

$0.064

-

-

$0.062

Corohmni

South Africa . 438 parts In-Stock

1+ parts

$2.548

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$2.548

-

-

-

Aztec Data Supply Inc.

USA . 3,912 parts In-Stock

1+ parts

$10.260

100+ parts

-

1k+ parts

-

10k+ parts

-

3,912

$10.260

-

-

-

Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$11.101

100+ parts

$10.657

1k+ parts

$10.213

10k+ parts

-

450

$11.101

$10.657

$10.213

-

AZTECH Wire

Italy . 962 parts In-Stock

1+ parts

$19.560

100+ parts

-

1k+ parts

-

10k+ parts

-

962

$19.560

-

-

-

Perfect Parts

USA . 50,400 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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50,400

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Microchip USA

USA . 104 parts In-Stock

1+ parts

-

100+ parts

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104

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Overview

Unlock a world of possibilities with the BCR410WH6327XTSA1 by Infineon Technologies. Designed with precision and expertise, this semiconductor offers unparalleled quality and reliability. Whether you're looking to enhance your analog circuits or optimize your electronic systems, this product is the perfect solution. With its compact design and advanced features, it provides unmatched value and performance. Experience the benefits of cutting-edge technology with the BCR410WH6327XTSA1 – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the semiconductor, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mount capability makes the product suitable for automated assembly processes, improving efficiency and reducing production costs.

Nominal Supply Voltage (Vsup): 3 V

Operates at a low nominal supply voltage, making it energy-efficient and suitable for battery-powered applications.

No. of Terminals: 4

Four terminals provide sufficient connectivity options for the application, offering flexibility in circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and very thin profile package style saves space on the PCB, making it ideal for compact electronic devices.

Terminal Finish: TIN

Tin terminal finish ensures reliable electrical connections and long-term performance of the semiconductor.

Width (mm): 1.25 mm

Narrow width of 1.25 mm allows for high density mounting of components on the PCB, maximizing functionality in a limited space.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB, making assembly process more efficient and reliable.

Technical Specifications

Other Function Semiconductors BCR410WH6327XTSA1 attributes and parameters. Explore more Other Function Semiconductors devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Width (mm):

1.25 mm

Trade Compliance

BCR410WH6327XTSA1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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