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BAS7004WE6327HTSA1

Infineon Technologies

BAS7004WE6327HTSA1 by Infineon Technologies

BAS7004WE6327HTSA1 by Infineon Technologies is a Schottky rectifier diode with 70V peak reverse voltage and 0.07A output current. It operates b/w -55°C to 125°C, suitable for automotive applications meeting AEC-Q101 standards. This small outline package with gull wing terminals is ideal for surface mount designs requiring high efficiency and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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VNN

France . 6,951 parts In-Stock

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Vyrian

USA . 3,660 parts In-Stock

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Digiode

USA . 500 parts In-Stock

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500

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Modulus Dynamics

Lithuania . 2,978 parts In-Stock

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$0.146

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$0.140

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$0.134

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Ampacity Inc.

Singapore . 163 parts In-Stock

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$1.010

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AZTECH Wire

Italy . 843 parts In-Stock

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Component Stockers USA

USA . 496 parts In-Stock

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Microchip USA

USA . 5,960 parts In-Stock

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Continental Prestige Electronics

USA . 2,553 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,543 parts In-Stock

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Argo Parts USA

USA . 2,313 parts In-Stock

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Corphita

USA . 377 parts In-Stock

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Bastille Electronics

Australia . 54 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BAS7004WE6327HTSA1 by Infineon Technologies. Crafted with precision and expertise, this diode & rectifier offers unparalleled quality and reliability. Whether you're in automotive, industrial, or consumer electronics, this product delivers high performance and efficiency. Say goodbye to compromises and hello to seamless operation with the BAS7004WE6327HTSA1. Elevate your projects with a product that not only meets but exceeds your expectations. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides protection and durability for the diode, ensuring a longer lifespan and reliable performance.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connection and center tap configuration allow for precise control and efficient operation of the diodes.

Surface Mount: YES

Being surface mountable makes this diode easy to install and saves space on the circuit board.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this diode can withstand heat without compromising its performance.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this product is ideal for converting AC to DC efficiently, making it suitable for a wide range of applications.

Technology: SCHOTTKY

Schottky diodes have low forward voltage drop and fast switching speed, making them ideal for high-frequency and high-speed applications.

Technical Specifications

Diodes & Rectifiers BAS7004WE6327HTSA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.07 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

70 V

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Trade Compliance

BAS7004WE6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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