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BAS4006WE6327HTSA1

Infineon Technologies

BAS4006WE6327HTSA1 by Infineon Technologies

BAS4006WE6327HTSA1 by Infineon is a Schottky rectifier diode with max output current of 0.12A and max repetitive peak reverse voltage of 40V. It comes in a small outline package shape, suitable for surface mount applications in electronics requiring high-speed switching capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 8,133 parts In-Stock

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VNN

France . 5,668 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Digiode

USA . 961 parts In-Stock

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Corohmni

South Africa . 187 parts In-Stock

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$0.034

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187

$0.034

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Modulus Dynamics

Lithuania . 27,949 parts In-Stock

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$0.091

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$0.087

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$0.084

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.109

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$0.099

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$0.089

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40

$0.109

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Aztec Data Supply Inc.

USA . 2,695 parts In-Stock

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$0.141

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$0.141

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Ampacity Inc.

Singapore . 930 parts In-Stock

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$2.010

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930

$2.010

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AZTECH Wire

Italy . 386 parts In-Stock

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$13.350

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$13.350

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QUARKTWIN TECHNOLOGY LTD

USA . 20,542 parts In-Stock

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Continental Prestige Electronics

USA . 5,524 parts In-Stock

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Microchip USA

USA . 4,967 parts In-Stock

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Argo Parts USA

USA . 1,509 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 591 parts In-Stock

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Overview

Discover the BAS4006WE6327HTSA1 by Infineon Technologies, a high-quality Schottky rectifier diode that offers exceptional performance and reliability. With its common anode configuration and small outline package style, this diode is ideal for a wide range of applications. From power supplies to battery charging circuits, this product provides customers with superior efficiency and precision. Trust in Infineon Technologies for cutting-edge technology and innovative solutions that deliver unparalleled value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the diodes, making it a reliable choice for electronic circuits.

Config: COMMON ANODE, 2 ELEMENTS

The common anode configuration with 2 elements allows for easy integration into circuits, enhancing the overall efficiency of the system.

Surface Mount: YES

The surface mount feature makes installation quick and convenient, saving time and reducing the risk of errors during assembly.

Package Shape: RECTANGULAR

The rectangular package shape is compact and space-saving, making it ideal for applications where board space is limited.

No. of Terminals: 3

With 3 terminals, this diode offers flexibility in circuit connections, allowing for versatile design options.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a sleek and modern design, making it suitable for compact electronic devices.

Terminal Position: DUAL

The dual terminal position offers stability and secure connections, ensuring reliable performance in various operating conditions.

Maximum Power Dissipation: 0.25W

The high maximum power dissipation of 0.25W allows the diode to handle heavy loads without overheating, ensuring long-term reliability.

Diode Type: RECTIFIER DIODE

Being a rectifier diode, this product efficiently converts AC to DC, making it essential for power supply applications.

Maximum Output Current: 0.12A

With a maximum output current of 0.12A, this diode can support moderate power requirements, making it suitable for a wide range of electronic devices.

Technology: SCHOTTKY

The Schottky technology utilized in this diode results in lower forward voltage drop and faster switching speeds, improving overall efficiency.

Terminal Form: GULL WING

The gull wing terminal form offers easy soldering and strong mechanical connections, ensuring secure placement on circuit boards.

No. of Elements: 2

Having 2 elements makes this diode suitable for applications requiring dual functionality, providing versatility in circuit design.

Maximum Repetitive Peak Reverse Voltage: 40V

The high maximum repetitive peak reverse voltage of 40V ensures reliable performance and protection against reverse voltage spikes.

Diode Element Material: SILICON

The silicon diode element material provides excellent thermal stability and reliability, ensuring consistent performance over time.

Technical Specifications

Diodes & Rectifiers BAS4006WE6327HTSA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

COMMON ANODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G3

No. of Elements:

2

No. of Terminals:

3

Maximum Output Current:

.12 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Maximum Repetitive Peak Reverse Voltage:

40 V

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Trade Compliance

BAS4006WE6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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