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BAS16UE6327HTSA1

Infineon Technologies

BAS16UE6327HTSA1 by Infineon Technologies

BAS16UE6327HTSA1 by Infineon Technologies is a rectifier diode with 3 separate elements, max output current of 0.2A, and max repetitive peak reverse voltage of 85V. It is designed for applications requiring fast switching speeds and high efficiency in small outline packages. Ideal for automotive electronics due to AEC-Q101 reference standard compliance.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,690 parts In-Stock

1+ parts

$0.064

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-

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5,690

$0.064

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Rochester

USA . 850,692 parts In-Stock

1+ parts

-

100+ parts

$0.109

1k+ parts

$0.091

10k+ parts

$0.081

850,692

-

$0.109

$0.091

$0.081

Verical

USA . 444,000 parts In-Stock

1+ parts

-

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-

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$0.101

444,000

-

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$0.101

Farnell

UK . 261,000 parts In-Stock

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$0.109

261,000

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-

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$0.109

Chip1Stop

Japan . 57 parts In-Stock

1+ parts

-

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$0.126

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57

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$0.126

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 153 parts In-Stock

1+ parts

$0.069

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-

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153

$0.069

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.080

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50

$0.080

-

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TME

Poland . 4,391 parts In-Stock

1+ parts

$0.140

100+ parts

$0.112

1k+ parts

$0.109

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-

4,391

$0.140

$0.112

$0.109

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Chip Stock

USA . 232,500 parts In-Stock

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232,500

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Vyrian

USA . 13,387 parts In-Stock

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13,387

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Component Sense

UK . 7,085 parts In-Stock

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7,085

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VNN

France . 637 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 195,678 parts In-Stock

1+ parts

$0.062

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195,678

$0.062

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Corphita

USA . 26 parts In-Stock

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$0.066

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26

$0.066

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.080

100+ parts

$0.078

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2,000

$0.080

$0.078

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Modulus Dynamics

Lithuania . 21,827 parts In-Stock

1+ parts

$0.199

100+ parts

$0.191

1k+ parts

$0.183

10k+ parts

-

21,827

$0.199

$0.191

$0.183

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AZTECH Wire

Italy . 1,214 parts In-Stock

1+ parts

$21.380

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1,214

$21.380

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Eastek

USA . 444,000 parts In-Stock

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444,000

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Overview

Experience the superior quality and reliability of the BAS16UE6327HTSA1 by Infineon Technologies, a leading manufacturer in the field of Diodes & Rectifiers. This versatile product offers a wide range of applications, providing customers with unmatched value and benefits. With its fast reverse recovery time and high operating temperature, this rectifier diode ensures optimal performance in various electronic devices. Trust in the excellence of Infineon Technologies to deliver top-notch products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection, making the product durable and long-lasting.

Config: SEPARATE, 3 ELEMENTS

Allows for efficient and effective use of each element separately, enhancing overall performance.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort.

Maximum Reverse Recovery Time: 0.004 us

Provides fast switching speed, enhancing overall efficiency of the product.

Package Shape: RECTANGULAR

Optimizes space utilization and facilitates easy integration into circuit designs.

No. of Terminals: 6

Offers flexibility in connecting the diodes, allowing for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact design for space-efficient circuit layouts.

Maximum Operating Temperature: 150 °C

Ensures reliable performance even in high-temperature environments.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Facilitates easy and secure connections in circuit setups.

Maximum Power Dissipation: 0.25 W

Handles power efficiently, preventing overheating and ensuring product longevity.

Reference Standard: AEC-Q101

Meets automotive industry quality standards for reliable performance in automotive applications.

Diode Type: RECTIFIER DIODE

Specifically designed for rectification of alternating current, making it suitable for various power applications.

Maximum Output Current: 0.2 A

Capable of handling moderate current levels, suitable for a range of electronic devices.

Terminal Form: GULL WING

Secure terminal design for reliable connections in circuit setups.

No. of Elements: 3

Optimized element count for efficient performance and circuit design flexibility.

Maximum Repetitive Peak Reverse Voltage: 85 V

Suits applications requiring up to 85 volts reverse voltage protection.

Diode Element Material: SILICON

Silicon diodes offer stable and reliable performance, suitable for a wide range of applications.

Technical Specifications

Diodes & Rectifiers BAS16UE6327HTSA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Config:

SEPARATE, 3 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

3

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Reference Standard:

AEC-Q101

Maximum Repetitive Peak Reverse Voltage:

85 V

Maximum Reverse Recovery Time:

.004 us

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAS16UE6327HTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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