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2EDN7533BXTSA1

Infineon Technologies

2EDN7533BXTSA1 by Infineon Technologies

2EDN7533BXTSA1 by Infineon Technologies is a MOSFET Gate Driver with 6 terminals and a package style of Small Outline, Low Profile, Shrink Pitch. It operates b/w -40 to 150 °C and has a max supply voltage of 20 V. Ideal for applications requiring push-pull output characteristics and a nominal voltage of 12 V.

Median Price

$0.860

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,450 parts In-Stock

1+ parts

$0.670

100+ parts

$0.372

1k+ parts

$0.319

10k+ parts

$0.293

2,450

$0.670

$0.372

$0.319

$0.293

Newark

USA . 3,257 parts In-Stock

1+ parts

$0.814

100+ parts

$0.451

1k+ parts

$0.385

10k+ parts

-

3,257

$0.814

$0.451

$0.385

-

DigiKey

USA . 2,990 parts In-Stock

1+ parts

$0.860

100+ parts

$0.477

1k+ parts

$0.409

10k+ parts

-

2,990

$0.860

$0.477

$0.409

-

Farnell

UK . 3,000 parts In-Stock

1+ parts

$0.884

100+ parts

$0.540

1k+ parts

$0.352

10k+ parts

$0.322

3,000

$0.884

$0.540

$0.352

$0.322

Element14

Singapore . 3,000 parts In-Stock

1+ parts

$1.390

100+ parts

$0.965

1k+ parts

$0.630

10k+ parts

$0.577

3,000

$1.390

$0.965

$0.630

$0.577

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$0.489

-

-

-

Digiode

USA . 564 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

564

$0.840

-

-

-

Vyrian

USA . 2,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,779

-

-

-

-

VNN

France . 1,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,673

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,648 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

10k+ parts

$0.479

3,648

$0.489

-

-

$0.479

Argo Parts USA

USA . 3,142 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

-

10k+ parts

$0.474

3,142

$0.489

-

-

$0.474

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.489

100+ parts

-

1k+ parts

$0.465

10k+ parts

$0.455

100

$0.489

-

$0.465

$0.455

Semicontronic

India . 2,920 parts In-Stock

1+ parts

$0.690

100+ parts

$0.673

1k+ parts

$0.669

10k+ parts

-

2,920

$0.690

$0.673

$0.669

-

Ampacity Inc.

Singapore . 2,696 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,696

$0.720

-

-

-

Corphita

USA . 600 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$0.796

-

-

-

Microchip USA

USA . 1,336 parts In-Stock

1+ parts

$3.172

100+ parts

-

1k+ parts

-

10k+ parts

-

1,336

$3.172

-

-

-

Corohmni

South Africa . 152 parts In-Stock

1+ parts

$7.447

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$7.447

-

-

-

Aztec Data Supply Inc.

USA . 344 parts In-Stock

1+ parts

$11.044

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$11.044

-

-

-

Modulus Dynamics

Lithuania . 4,173 parts In-Stock

1+ parts

$14.154

100+ parts

$13.588

1k+ parts

$13.022

10k+ parts

-

4,173

$14.154

$13.588

$13.022

-

Overview

Experience seamless performance and reliability with the 2EDN7533BXTSA1 MOSFET Gate Driver from Infineon Technologies. Crafted with precision and quality materials, this versatile driver offers dual functions in a compact package, making it ideal for a wide range of applications. With a maximum supply voltage of 20V and output characteristics that ensure efficient push-pull operation, this driver guarantees smooth functionality even in extreme temperatures. Trust in the value and benefits of this product to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, perfect for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 20 V

Can accommodate a wide range of supply voltages, offering versatility in different electronic systems.

Minimum Supply Voltage: 4.5 V

Works efficiently even at low supply voltages, ensuring compatibility with various power sources.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for demanding industrial environments.

Output Characteristics: PUSH-PULL

Push-pull output configuration provides strong and fast signal transitions, improving overall efficiency and performance.

Nominal Output Peak Current Limit: 5 A

High output current limit allows for driving power MOSFETs with ease, making it suitable for high power applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Buffer or inverter based design offers flexibility in driving MOSFETs with different input signal requirements, enhancing compatibility.

Technical Specifications

MOSFET Gate Drivers 2EDN7533BXTSA1 attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

NO

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

PUSH-PULL

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Turn-off Time:

.025 us

Turn-on Time:

.025 us

Width:

1.6 mm

Trade Compliance

2EDN7533BXTSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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