Loading...

1EDI20N12AF

Infineon Technologies

1EDI20N12AF by Infineon Technologies

1EDI20N12AF by Infineon Technologies is a MOSFET Gate Driver with 8 terminals, operating at -40 to 125 °C. It has a turn-on time of 0.137 us and turn-off time of 0.143 us. Ideal for automotive applications due to its small outline package style and dual terminal position.

Median Price

$1.566

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 1,600 parts In-Stock

1+ parts

$1.556

100+ parts

$0.939

1k+ parts

$0.793

10k+ parts

-

1,600

$1.556

$0.939

$0.793

-

Digiode

USA . 135 parts In-Stock

1+ parts

$1.577

100+ parts

-

1k+ parts

-

10k+ parts

-

135

$1.577

-

-

-

Greenchips

USA . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100,000

-

-

-

-

Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

VNN

France . 2,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

-

-

-

-

Vyrian

USA . 1,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,871

-

-

-

-

HZD GmbH

Germany . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,851

-

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 295 parts In-Stock

1+ parts

$1.494

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$1.494

-

-

-

Ampacity Inc.

Singapore . 1,751 parts In-Stock

1+ parts

$2.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

$2.150

-

-

-

Semicontronic

India . 1,912 parts In-Stock

1+ parts

$4.680

100+ parts

$4.563

1k+ parts

$4.540

10k+ parts

-

1,912

$4.680

$4.563

$4.540

-

Corohmni

South Africa . 313 parts In-Stock

1+ parts

$6.622

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$6.622

-

-

-

Modulus Dynamics

Lithuania . 75 parts In-Stock

1+ parts

$10.900

100+ parts

$10.464

1k+ parts

$10.028

10k+ parts

-

75

$10.900

$10.464

$10.028

-

S.R.D Solutions

India . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60,000

-

-

-

-

Lixinc

USA . 10,948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,948

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,486

-

-

-

-

Perfect Parts

USA . 7,444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,444

-

-

-

-

Kepictronics

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,500

-

-

-

-

Continental Prestige Electronics

USA . 5,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,253

-

-

-

-

Argo Parts USA

USA . 4,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,092

-

-

-

-

Bastille Electronics

Australia . 1,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,350

-

-

-

-

Overview

Infineon EiceDRIVER™ Gate Driver ICs are designed for MOSFETs, IGBTs, SiC MOSFETs, and GaN HEMTs devices. EiceDRIVER™ gate drivers provide a wide range of typical output current options, from 0.1A up to 10A. These devices have robust gate drive protection features such as fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault, shutdown, and over current protection. These features make these driver ICs well-suited for both silicon and wide-bandgap power devices, including CoolGaN™, and CoolSiC™. That’s why Infineon offers more than 500 EiceDRIVER™ gate driver IC solutions suitable for any power switch, and any application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and heat resistance, making the product reliable for various applications.

Surface Mount: YES

This feature allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

Maximum Supply Voltage: 17 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the PCB, optimizing space utilization in the design.

No. of Terminals: 8

With a sufficient number of terminals, this MOSFET gate driver can easily connect to other components for seamless integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and ensures efficient heat dissipation, enhancing performance.

Minimum Supply Voltage: 3.1 V

The low minimum supply voltage allows for operation in scenarios where power is limited, providing flexibility in usage.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in extreme conditions, increasing durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this gate driver suitable for use in cold environments or outdoor applications.

Terminal Finish: TIN

The tin terminal finish offers good conductivity and corrosion resistance, improving the overall reliability of the product.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection options to meet specific design requirements.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage simplifies compatibility with common power sources, making it easy to integrate into existing systems.

Turn-on Time: 0.137 us

The fast turn-on time ensures quick response and efficient operation, enhancing the overall performance of the gate driver.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact size and high density on the PCB, facilitating efficient design layouts.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates robust packaging, making the product suitable for a variety of environments with moderate moisture exposure.

Nominal Output Peak Current Limit: 4 A

The high output current limit allows the gate driver to handle high loads, providing reliability and safety in operation.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based interface IC type offers versatility in controlling MOSFETs, enabling compatibility with various system designs.

Turn-off Time: 0.143 us

The fast turn-off time ensures efficient switching and reduces power losses, enhancing the overall efficiency of the gate driver.

Technical Specifications

MOSFET Gate Drivers 1EDI20N12AF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

17 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

35 V

Minimum Supply Voltage-1:

10 V

Nominal Supply Voltage-1:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.143 us

Turn-on Time:

.137 us

Width:

3.9 mm

Trade Compliance

1EDI20N12AF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19