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MC9S08SE4MTG

Freescale Semiconductor

MC9S08SE4MTG by Freescale Semiconductor

Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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< 1k

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One Stop Electronics

USA . 461 parts In-Stock

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$11.000

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461

$11.000

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Microchip USA

USA . 244 parts In-Stock

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$17.018

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244

$17.018

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A-Z Elektronik GmbH

Germany . 5,648 parts In-Stock

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5,648

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Technical Specifications

Microcontrollers MC9S08SE4MTG attributes and parameters. Explore more Microcontrollers devices from Freescale Semiconductor

Specs

Bit Size:

8

CPU Family:

HCS08

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MC9S08SE4MTG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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