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MC33662BLEF

Freescale Semiconductor

MC33662BLEF by Freescale Semiconductor

INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.684

Lifecycle Status

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5

In-Stock Inventory

1k+

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Rochester

USA . 294 parts In-Stock

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$0.684

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$0.568

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$0.506

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Chip Stock

USA . 14,280 parts In-Stock

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Microchip USA

USA . 2,982 parts In-Stock

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One Stop Electronics

USA . 1,011 parts In-Stock

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UNI Independent Distributors

Spain . 7,476 parts In-Stock

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A-Z Elektronik GmbH

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Corphita

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Technical Specifications

Network Interfaces MC33662BLEF attributes and parameters. Explore more Network Interfaces devices from Freescale Semiconductor

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MC33662BLEF Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Freescale Semiconductor

On December 7, 2015, NXP completed the merger with Freescale Semiconductor; the merged company continued its operation as NXP Semiconductors N.V.

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