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ICKSMDN8MI

Fischer Elektronik & Kg

ICKSMDN8MI by Fischer Elektronik & Kg

HEAT SINK; Device Used On: IC; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Height: 6 mm; Finish: BLACK ANODIZED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Heat Sinks ICKSMDN8MI attributes and parameters. Explore more Heat Sinks devices from Fischer Elektronik & Kg

Device Specifications

Construction:

Fin Orientation:

Packing Method:

Tape and Reel

Physical Specifications

Height:

0.236 in (6 mm)

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Material and Finish

Finish:

Black Anodized

Color:

Black

Thermal Specifications

Thermal Resistance:

74 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

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