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SM8S36A

Eic Semiconductor

SM8S36A by Eic Semiconductor

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: SINGLE; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$3.885

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$3.670

100+ parts

$1.880

1k+ parts

$1.340

10k+ parts

$1.270

500

$3.670

$1.880

$1.340

$1.270

DigiKey

USA . 1,808 parts In-Stock

1+ parts

$4.100

100+ parts

$1.896

1k+ parts

$1.489

10k+ parts

$1.399

1,808

$4.100

$1.896

$1.489

$1.399

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,840 parts In-Stock

1+ parts

$1.886

100+ parts

-

1k+ parts

-

10k+ parts

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2,840

$1.886

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Bristol Electronics

USA . 388 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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388

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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13,000

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-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

-

-

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S.R.D Solutions

India . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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500

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Technical Specifications

Transient Suppression Devices SM8S36A attributes and parameters. Explore more Transient Suppression Devices devices from Eic Semiconductor

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

48.9 V

Minimum Breakdown Voltage:

40 V

Nominal Breakdown Voltage:

42.1 V

Case Connection:

ANODE

Maximum Clamping Voltage:

58.1 V

Config:

COMMON ANODE, 2 ELEMENTS

Diode Element Material:

SILICON

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

Maximum Non Repetitive Peak Reverse Power Dissipation:

6600 W

No. of Elements:

2

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

8 W

Maximum Repetitive Peak Reverse Voltage:

36 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

SM8S36A Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Eic Semiconductor

EIC is a major international manufacturer and supplier of discrete semiconductors. With over 15,000 parts and more than 50 package types, EIC offers one of the most comprehensive diode portfolios in the industry. The company’s products can be classified into five main categories: • Rectifier Diodes • High Speed Switching / Small Signal Diodes • Zener Diodes • Transient Voltage Suppressor Diodes • Transistors EIC provides end to end manufacturing with a dedicated wafer fab and assembly plant to ensure control of quality and supply. Expansion of the wafer fab during 2007 has provided EIC with the ability to supply products in die and wafer form, in addition to packaged parts. EIC provides its customers with world-class service and technical support, as well as high quality products at competitive prices. The company’s processes and procedures, from design to after sales service, are fully ISO 9001, ISO14001 and ISO/TS16949 certified, and all products are RoHs compliant. With sales offices worldwide, and a reliable logistics process, EIC is able to offer customers quick responses to both technical enquiries and product delivery. The EIC Engineering team is focused on developing superior discrete products to satisfy the variety of requirements from new customer systems. The company also offers an extensive capability for research and development of special purpose devices, to satisfy unique customer applications. These are achieved with close attention to cost reduction and fast time to market.

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