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1N5627

Eic Semiconductor

1N5627 by Eic Semiconductor

RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;

Median Price

$2.157

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

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DigiKey Marketplace

USA . 676 parts In-Stock

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$1.750

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$1.450

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DF Sales Co.

USA . 200 parts In-Stock

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$2.157

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DF Sales Co.

USA . 200 parts In-Stock

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200

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American Microsemiconductor Inc.

USA . 1,479 parts In-Stock

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$5.000

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ComSIT Distribution GmbH

Germany . 12,980 parts In-Stock

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ECAB

Sweden . 2,120 parts In-Stock

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Bristol Electronics

USA . 1,551 parts In-Stock

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$0.338

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$0.252

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$0.234

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LIBRA Elektronik GmbH

Germany . 1,500 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 889 parts In-Stock

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Global Solutions Electronics Company

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 222 parts In-Stock

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Tech-Mark Corp

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Electro Mavin

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Pegasus Components GmbH

Germany . 23 parts In-Stock

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Elcom Components

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First Choice Components Inc.

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Lakeview Electronics

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Mil-Aero Solutions, Inc.

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LittleDiode

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Huijzer Components

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Distributors (Availability)

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Native Components

USA . 19 parts In-Stock

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$29.374

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Northwest PG Solutions

USA . 1,550 parts In-Stock

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$32.311

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$29.080

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QUARKTWIN TECHNOLOGY LTD

USA . 15,245 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Microchip USA

USA . 4,415 parts In-Stock

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Assy Fe

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Glotronic Ltd.

UK . 2,300 parts In-Stock

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Supply Digital

USA . 1,199 parts In-Stock

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Perfect Parts

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Montclair Electronics, Inc.

USA . 3 parts In-Stock

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Technical Specifications

Diodes & Rectifiers 1N5627 attributes and parameters. Explore more Diodes & Rectifiers devices from Eic Semiconductor

Specs

Additional Features:

HIGH RELIABILITY

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1 V

JESD-30 Code:

O-PALF-W2

Maximum Non Repetitive Peak Forward Current:

125 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Repetitive Peak Reverse Voltage:

800 V

Maximum Reverse Current:

5 uA

Surface Mount:

NO

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

1N5627 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-00-004-5556, 5961000045556

NIIN

000045556

Manufacturer Highlights

Eic Semiconductor

EIC is a major international manufacturer and supplier of discrete semiconductors. With over 15,000 parts and more than 50 package types, EIC offers one of the most comprehensive diode portfolios in the industry. The company’s products can be classified into five main categories: • Rectifier Diodes • High Speed Switching / Small Signal Diodes • Zener Diodes • Transient Voltage Suppressor Diodes • Transistors EIC provides end to end manufacturing with a dedicated wafer fab and assembly plant to ensure control of quality and supply. Expansion of the wafer fab during 2007 has provided EIC with the ability to supply products in die and wafer form, in addition to packaged parts. EIC provides its customers with world-class service and technical support, as well as high quality products at competitive prices. The company’s processes and procedures, from design to after sales service, are fully ISO 9001, ISO14001 and ISO/TS16949 certified, and all products are RoHs compliant. With sales offices worldwide, and a reliable logistics process, EIC is able to offer customers quick responses to both technical enquiries and product delivery. The EIC Engineering team is focused on developing superior discrete products to satisfy the variety of requirements from new customer systems. The company also offers an extensive capability for research and development of special purpose devices, to satisfy unique customer applications. These are achieved with close attention to cost reduction and fast time to market.

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