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ZXGD3103N8TC

Diodes Incorporated

ZXGD3103N8TC by Diodes Incorporated

ZXGD3103N8TC by Diodes Inc. is a MOSFET gate driver with 10V power supply, 15V max supply voltage, and half-bridge interface IC type. Ideal for applications requiring high side drivers in compact spaces due to its small outline package style and dual terminal position.

Median Price

$0.732

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,500 parts In-Stock

1+ parts

$0.544

100+ parts

$0.446

1k+ parts

$0.385

10k+ parts

-

1,500

$0.544

$0.446

$0.385

-

Mouser Electronics

USA . 72 parts In-Stock

1+ parts

$0.920

100+ parts

$0.529

1k+ parts

$0.459

10k+ parts

$0.438

72

$0.920

$0.529

$0.459

$0.438

DigiKey

USA . 3,057 parts In-Stock

1+ parts

$0.930

100+ parts

$0.530

1k+ parts

$0.459

10k+ parts

-

3,057

$0.930

$0.530

$0.459

-

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.385

10k+ parts

-

1,500

-

-

$0.385

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.831

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$0.831

-

-

-

Chip Stock

USA . 45,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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45,503

-

-

-

-

NAC Semi

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,000

-

-

-

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Vyrian

USA . 7,621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,621

-

-

-

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Cyclops Electronics Ltd

UK . 3,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,676

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 33,495 parts In-Stock

1+ parts

$0.327

100+ parts

$0.319

1k+ parts

$0.317

10k+ parts

-

33,495

$0.327

$0.319

$0.317

-

Corohmni

South Africa . 35 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$0.462

-

-

-

Continental Prestige Electronics

USA . 4,353 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

$0.467

4,353

$0.477

-

-

$0.467

Argo Parts USA

USA . 4,284 parts In-Stock

1+ parts

$0.477

100+ parts

-

1k+ parts

-

10k+ parts

$0.463

4,284

$0.477

-

-

$0.463

Ampacity Inc.

Singapore . 32,766 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

32,766

$0.710

-

-

-

Aztec Data Supply Inc.

USA . 3,534 parts In-Stock

1+ parts

$12.860

100+ parts

-

1k+ parts

-

10k+ parts

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3,534

$12.860

-

-

-

Perfect Parts

USA . 11,304 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,304

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

-

-

Lixinc

USA . 1,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,498

-

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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450

-

-

-

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iodParts Technologies Inc.

India . 250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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250

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Kepictronics

USA . 155 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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155

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Overview

Enhance the performance of your electronic designs with the ZXGD3103N8TC MOSFET Gate Driver from Diodes Incorporated. As a trusted manufacturer, Diodes Incorporated delivers top-quality products for a wide range of applications. With its high-side driver feature and small outline package style, this gate driver offers exceptional value, providing reliable power supply with a nominal voltage of 10V and a maximum supply voltage of 15V. Experience seamless integration and improved efficiency with the ZXGD3103N8TC, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, ensuring better performance and longevity.

Surface Mount: YES

Being surface mountable, this product allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 15 V

With a maximum supply voltage of 15V, this gate driver can handle higher power requirements effectively, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space on the circuit board and allowing for efficient layout.

Power Supplies (V): 10

With a power supply of 10V, this gate driver offers sufficient power for driving MOSFETs in a range of applications, ensuring reliable and consistent performance.

No. of Terminals: 8

Having 8 terminals provides ample connections for interfacing with other components, allowing for versatile usage and compatibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact form factor, making it suitable for space-constrained applications without compromising on performance.

Minimum Supply Voltage: 5 V

With a minimum supply voltage of 5V, this gate driver can operate efficiently even with lower power sources, providing flexibility in various operating conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good conductivity and solderability, enhancing the overall reliability and longevity of the product.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting orientations, providing flexibility in circuit board layout and installation.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75mm, this gate driver offers a low-profile design, enabling compact and space-saving integration in various applications.

Width: 3.9 mm

The narrow width of 3.9mm enables efficient space utilization on the circuit board, enabling more compact and streamlined designs.

High Side Driver: YES

The high side driver functionality allows for driving MOSFETs connected to the high side of the load, enhancing the overall efficiency and performance of the system.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and reliability during assembly, contributing to the overall quality of the product.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this gate driver can withstand high-temperature reflow processes, ensuring robust solder joints and long-term reliability.

Length: 5.05 mm

The length of 5.05mm provides a compact footprint, allowing for efficient use of space on the circuit board and enabling versatile integration in various applications.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and secure solder connections, enhancing the durability and reliability of the product.

Nominal Supply Voltage: 10 V

With a nominal supply voltage of 10V, this gate driver operates efficiently within a standard voltage range, ensuring stable and consistent performance in various applications.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides sufficient spacing between terminals for easy soldering and maintenance, enhancing usability and reliability.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

The half bridge based MOSFET driver interface IC type enables efficient and precise control of MOSFET switches in half-bridge configurations, offering enhanced performance and flexibility in power electronics applications.

Technical Specifications

MOSFET Gate Drivers ZXGD3103N8TC attributes and parameters. Explore more MOSFET Gate Drivers devices from Diodes Incorporated

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.05 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

10

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ZXGD3103N8TC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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