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ZHCS400

Diodes Incorporated

ZHCS400 by Diodes Incorporated

ZHCS400 by Diodes Inc. is a Schottky rectifier diode with a max forward voltage of 0.3V and output current of 0.4A, ideal for applications requiring fast switching speeds and low power dissipation. With a max repetitive peak reverse voltage of 40V and surface mount configuration, it is suitable for compact electronic designs operating at temperatures up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,374 parts In-Stock

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Goldney Electronics S.L.

Spain . 250 parts In-Stock

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NPI Materials, Inc.

USA . 65 parts In-Stock

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Nova Conductors

Japan . 18 parts In-Stock

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J2 Sourcing AB

Sweden . 7 parts In-Stock

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AZTECH Wire

Italy . 520 parts In-Stock

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$15.784

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520

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Perfect Parts

USA . 18,519 parts In-Stock

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Argo Parts USA

USA . 2,773 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 870 parts In-Stock

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Bastille Electronics

Australia . 34 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Diodes Incorporated with the ZHCS400, a top-of-the-line rectifier diode. Perfect for a wide range of applications, this Schottky technology diode offers fast switching speeds and low forward voltage for efficient performance. With a small outline package and dual terminals, the ZHCS400 is easy to install and operate. Trust Diodes Incorporated to deliver cutting-edge technology and superior products that meet your needs. Unlock the potential of your projects with the ZHCS400 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Config: SINGLE

Single configuration simplifies installation and usage, ideal for straightforward applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient PCB integration.

Maximum Reverse Recovery Time: 0.01 us

Fast reverse recovery time ensures efficient operation and minimal power loss.

Package Shape: RECTANGULAR

Rectangular shape facilitates compact design and efficient use of space on the circuit board.

No. of Terminals: 2

Two terminals provide easy connectivity and installation in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables high-density mounting.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures reliable performance even in demanding conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures a secure connection.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and installation.

Maximum Power Dissipation: 0.25 W

Low power dissipation helps in maintaining the temperature and efficiency of the diode.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering process during PCB assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints and product longevity.

Diode Type: RECTIFIER DIODE

Rectifier diode design enables efficient conversion of AC to DC currents, making it suitable for power supply applications.

Maximum Forward Voltage (VF): 0.3 V

Low forward voltage drop minimizes power losses and increases overall efficiency.

Maximum Output Current: 0.4 A

High output current capacity allows for reliable and stable operation under load.

Technology: SCHOTTKY

Schottky technology offers fast switching speeds and low forward voltage drop, ideal for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminal form provides ease of mounting and allows for secure PCB attachment.

Maximum Repetitive Peak Reverse Voltage: 40 V

High repetitive peak reverse voltage rating offers protection against voltage spikes and surges.

Maximum Non Repetitive Peak Forward Current: 6.75 A

High peak forward current rating ensures the diode can handle sudden spikes in the current flow.

Diode Element Material: SILICON

Silicon diode element material provides high reliability and efficiency in converting electrical energy.

Technical Specifications

Diodes & Rectifiers ZHCS400 attributes and parameters. Explore more Diodes & Rectifiers devices from Diodes Incorporated

Specs

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.3 V

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

6.75 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

.4 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

40 V

Maximum Reverse Recovery Time:

.01 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ZHCS400 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.70

SB

8541.10.00.70

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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