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DESD5V0V1BCSP-7

Diodes Incorporated

DESD5V0V1BCSP-7 by Diodes Incorporated

TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.038

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.033

1,432

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-

-

$0.033

Verical

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.044

1,432

-

-

-

$0.044

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,992

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-

-

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SPM Sales

USA . 164 parts In-Stock

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164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 4,557 parts In-Stock

1+ parts

$0.050

100+ parts

$0.050

1k+ parts

$0.050

10k+ parts

-

4,557

$0.050

$0.050

$0.050

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.066

100+ parts

$0.060

1k+ parts

$0.054

10k+ parts

-

100

$0.066

$0.060

$0.054

-

Native Components

USA . 569 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

569

$0.079

-

-

$0.076

Northwest PG Solutions

USA . 172 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

172

$0.087

-

-

$0.076

Corohmni

South Africa . 521 parts In-Stock

1+ parts

$0.125

100+ parts

-

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521

$0.125

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AZTECH Wire

Italy . 174 parts In-Stock

1+ parts

$12.770

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174

$12.770

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Kepictronics

USA . 408,964 parts In-Stock

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408,964

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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Technical Specifications

Transient Suppression Devices DESD5V0V1BCSP-7 attributes and parameters. Explore more Transient Suppression Devices devices from Diodes Incorporated

Specs

Maximum Breakdown Voltage:

10 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

JESD-609 Code:

e4

Maximum Non Repetitive Peak Reverse Power Dissipation:

20 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.25 W

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

Trade Compliance

DESD5V0V1BCSP-7 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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