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APX810S-40SR-7

Diodes Incorporated

APX810S-40SR-7 by Diodes Incorporated

APX810S-40SR-7 by Diodes Inc. is a Power Management IC with 3 terminals, operating b/w -40 to 125°C. It supports power supply circuits with a min voltage of 1V and max current of 20mA. Ideal for automotive applications due to its small outline package and matte tin finish.

Median Price

$0.321

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$0.560

100+ parts

$0.220

1k+ parts

$0.143

10k+ parts

$0.096

12

$0.560

$0.220

$0.143

$0.096

Verical

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.082

24,000

-

-

-

$0.082

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 16,843 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

$0.080

16,843

$0.380

-

-

$0.080

Microchip USA

USA . 982 parts In-Stock

1+ parts

$0.705

100+ parts

-

1k+ parts

-

10k+ parts

-

982

$0.705

-

-

-

Andel Nordic

Denmark . 5,844 parts In-Stock

1+ parts

$2.242

100+ parts

-

1k+ parts

$2.152

10k+ parts

$2.152

5,844

$2.242

-

$2.152

$2.152

RC Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.170

1k+ parts

$0.160

10k+ parts

$0.160

18,000

-

$0.170

$0.160

$0.160

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

$24.645

1k+ parts

$22.821

10k+ parts

$22.821

500

-

$24.645

$22.821

$22.821

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$24.645

1k+ parts

$22.821

10k+ parts

$22.821

500

-

$24.645

$22.821

$22.821

Native Components

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.006

10k+ parts

-

115

-

-

$4.006

-

Northwest PG Solutions

USA . 66 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.047

10k+ parts

-

66

-

-

$4.047

-

Overview

Enhance your power management capabilities with the APX810S-40SR-7 from Diodes Incorporated. Designed with precision and reliability in mind, this small outline power management IC offers unparalleled performance in automotive applications. With a wide operating temperature range and high-quality construction, this product ensures optimal functionality and efficiency. Trust Diodes Incorporated to deliver cutting-edge solutions that provide value, benefits, and advantages to customers seeking top-notch power supply support circuits. Elevate your operations with the APX810S-40SR-7 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and easy integration into existing designs.

No. of Terminals: 3

The 3 terminals provide the necessary connections for power management functionality while keeping the overall design simple.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for compact system designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in cold environments without compromising functionality.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layout options and easy connections.

Maximum Seated Height: 1.1 mm

The low maximum seated height helps in achieving a slim and compact overall system design.

Width (mm): 1.3 mm

The small width dimension allows for space-efficient placement on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit IC, it provides essential functions for managing power distribution within the system.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage enables operation in low-power scenarios without any issues.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering during assembly processes.

Length: 2.9 mm

The short length dimension contributes to the compact form factor of the overall product.

Nominal Threshold Voltage (V): +4V

The nominal threshold voltage of +4V ensures proper signal detection and control within the device.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade means the product is suitable for use in automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 20 mA

With a maximum supply current of 20 mA, the product can efficiently handle power requirements within its specified limits.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical connections and ease of soldering during assembly.

Terminal Pitch: 0.915 mm

The small terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability ensures compatibility with various power supply configurations.

Technical Specifications

Power Management ICs APX810S-40SR-7 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Additional Features:

RESET THESHOULD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TSOP3,.09,36

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.915 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Width (mm):

1.3 mm

Trade Compliance

APX810S-40SR-7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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