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AP9211SA-AA-HAC-7

Diodes Incorporated

AP9211SA-AA-HAC-7 by Diodes Incorporated

Diodes Inc.'s AP9211SA-AA-HAC-7 is a power management IC with 1 function. It operates at a supply voltage of 3.5V and has a small outline, heat sink package style. It is commonly used as a power supply support circuit in industrial applications.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 13,094 parts In-Stock

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$0.249

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$0.249

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Vyrian

USA . 7,667 parts In-Stock

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7,667

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Nova Conductors

Japan . 200 parts In-Stock

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200

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VNN

France . 90 parts In-Stock

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90

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Ampacity Inc.

Singapore . 8,048 parts In-Stock

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$0.212

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Continental Prestige Electronics

USA . 5,998 parts In-Stock

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$0.216

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Microchip USA

USA . 1,629 parts In-Stock

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$1.640

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Aztec Data Supply Inc.

USA . 1,204 parts In-Stock

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$14.444

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Corohmni

South Africa . 260 parts In-Stock

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$23.444

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260

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,353 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Perfect Parts

USA . 205 parts In-Stock

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Overview

Experience unparalleled power management with the AP9211SA-AA-HAC-7 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated guarantees top-notch quality and reliability. This Power Management IC is designed for various applications, offering customers unmatched value and benefits. With its small outline, very thin profile, and heat sink/slug package style, it delivers exceptional performance in a compact design. Whether you're looking for a power supply support circuit or need efficient power management for your industrial-grade equipment, the AP9211SA-AA-HAC-7 is the perfect choice. Trust Diodes Incorporated to provide you with the best solution for all your power management needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product has a durable and lightweight package body material, making it suitable for various applications.

Surface Mount:

YES - With a surface mount feature, this product can be easily mounted on circuit boards, saving space and allowing for efficient assembly.

No. of Functions:

1 - Despite its compact design, this product offers a single function, providing a simple and focused solution.

Package Shape:

RECTANGULAR - The rectangular package shape of this product enhances its compatibility with standard electronic devices and facilitates easy integration.

Nominal Supply Voltage (Vsup):

3.5 V - The 3.5V nominal supply voltage of this product ensures compatibility with a wide range of power supply systems, making it versatile and adaptable.

No. of Terminals:

6 - With six terminals, this product offers multiple connection points, enabling flexible circuit configurations and enhancing its functionality.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - The small outline, heat sink/slug, and very thin profile package style of this product allow for efficient heat dissipation and installation in space-constrained environments.

Maximum Operating Temperature:

85 °C - This product can operate at a maximum temperature of 85°C, ensuring reliable performance even in demanding thermal conditions.

Minimum Operating Temperature:

40 °C - The minimum operating temperature of -40°C enables this product to function effectively in extremely cold environments or applications requiring low-temperature operation.

Terminal Position:

DUAL - The dual terminal position of this product provides increased flexibility for circuit board layout and connection options.

Maximum Seated Height:

0.6 mm - With a maximum seated height of only 0.6mm, this product is suitable for compact designs where space is limited.

Width (mm):

2 mm - The 2mm width of this product allows for efficient placement on the circuit board, maximizing space utilization.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This product serves as a power supply support circuit, enhancing the stability and efficiency of power management systems.

Minimum Supply Voltage (Vsup):

1.5 V - The ability to operate with a minimum supply voltage of 1.5V ensures compatibility with lower power systems, providing flexibility in various applications.

Maximum Time At Peak Reflow Temperature (s):

30 - This product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C allows for efficient and precise soldering, ensuring secure connections and minimizing the risk of solder defects.

Length:

3 mm - With a compact length of 3mm, this product is suitable for space-constrained designs without sacrificing performance.

Nominal Threshold Voltage (V):

+4.375V - The nominal threshold voltage of +4.375V ensures accurate switching and control, offering precise power management capabilities.

Temperature Grade:

INDUSTRIAL - This product is designed and rated for industrial temperature ranges, ensuring reliable operation in harsh conditions.

Maximum Supply Current (Isup):

0.007 mA - With a maximum supply current of only 0.007mA, this product offers minimal power consumption, making it energy-efficient.

No. of Channels:

1 - This product provides a single channel, simplifying its implementation and making it an optimal choice for applications that require a single stream of power management.

Technology:

CMOS - Built with CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuits.

Terminal Form:

NO LEAD - The no-lead terminal form of this product, such as surface mount or solder balls, ensures easy and reliable connections during the assembly process.

Maximum Supply Voltage (Vsup):

5.5 V - With a maximum supply voltage of 5.5V, this product can handle higher voltage levels, providing robust power management capabilities.

Technical Specifications

Power Management ICs AP9211SA-AA-HAC-7 attributes and parameters. Explore more Power Management ICs devices from Diodes Incorporated

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N6

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.08X.12,24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.6 mm

Maximum Supply Current (Isup):

.007 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.375V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

AP9211SA-AA-HAC-7 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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