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AP3031MTR-G1

Diodes Incorporated

AP3031MTR-G1 by Diodes Incorporated

Diodes Inc.'s AP3031MTR-G1 is an LED display driver with 39 segments, operating at a supply voltage range of 2.7V to 16V. This small outline package has a rectangular shape, Gull Wing terminals, and can withstand industrial temperatures from -40°C to 85°C. Ideal for graphics displays in various applications requiring precise control and high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 30,910 parts In-Stock

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30,910

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Vyrian

USA . 337 parts In-Stock

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337

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Nova Conductors

Japan . 42 parts In-Stock

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42

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 675 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

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675

$4.500

$4.388

$4.365

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$7.281

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208

$7.281

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Aztec Data Supply Inc.

USA . 305 parts In-Stock

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$8.890

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305

$8.890

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$14.368

100+ parts

$13.075

1k+ parts

$11.782

10k+ parts

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50

$14.368

$13.075

$11.782

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AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$16.966

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337

$16.966

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Continental Prestige Electronics

USA . 3,581 parts In-Stock

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3,581

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Argo Parts USA

USA . 3,008 parts In-Stock

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3,008

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Microchip USA

USA . 297 parts In-Stock

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297

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Enhance your display performance with the AP3031MTR-G1 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality graphics display drivers that guarantee reliability and efficiency. Ideal for applications requiring high-quality LED display drivers, this product offers exceptional value with its wide operating temperature range and small outline package style. Elevate your visual experience and trust Diodes Incorporated to provide cutting-edge solutions for all your display driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 16 V

High maximum supply voltage provides flexibility in power input options for different applications.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage enables operation in low power environments, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme cold temperatures without issue.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and resistance to oxidation, ensuring long-term reliability.

Width: 3.9 mm

Slim width design saves space on the PCB and allows for compact product designs.

Length: 4.9 mm

Compact length size makes the product suitable for small form factor devices and tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh industrial environments.

No. of Segments: 39

High number of segments provides versatility in displaying various types of information or graphics.

Technical Specifications

Graphics Display Drivers AP3031MTR-G1 attributes and parameters. Explore more Graphics Display Drivers devices from Diodes Incorporated

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

39

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AP3031MTR-G1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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