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AH3761-PG-B

Diodes Incorporated

AH3761-PG-B by Diodes Incorporated

MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Range: 50-90mA;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,189 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

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10k+ parts

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1,189

$13.180

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Ampacity Inc.

Singapore . 373 parts In-Stock

1+ parts

$35.750

100+ parts

-

1k+ parts

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10k+ parts

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373

$35.750

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Native Components

USA . 412 parts In-Stock

1+ parts

$202.271

100+ parts

-

1k+ parts

-

10k+ parts

$194.181

412

$202.271

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-

$194.181

Northwest PG Solutions

USA . 881 parts In-Stock

1+ parts

$222.499

100+ parts

-

1k+ parts

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10k+ parts

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881

$222.499

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Perfect Parts

USA . 692 parts In-Stock

1+ parts

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692

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Technical Specifications

Magnetic Field Sensors AH3761-PG-B attributes and parameters. Explore more Magnetic Field Sensors devices from Diodes Incorporated

Specs

Additional Features:

SEATED HEIGHT-CALCULATED

Body Width:

1.5 inch

Body Height:

4.55 mm

Body Length/Diameter:

4.1 mm

Hysteresis:

6 mT

JESD-609 Code:

e3

Maximum Magnetic Field Range:

6 mT

Minimum Range Of Magnetic Field:

-6 mT

Mounting Feature:

No. of Terminals:

3

Maximum Operating Current:

6 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

OPEN-DRAIN

Maximum Output Current:

90 A

Output Range:

Output Type:

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.03,50

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

3 V

Terminal Finish:

MATTE TIN

Termination Type:

SOLDER

Trade Compliance

AH3761-PG-B Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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