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IW3602-31

Dialog Semiconductor

IW3602-31 by Dialog Semiconductor

LED DISPLAY DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 150 parts In-Stock

1+ parts

$1.689

100+ parts

-

1k+ parts

$1.622

10k+ parts

$1.622

150

$1.689

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$1.622

$1.622

Component Stockers USA

USA . 544 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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10k+ parts

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544

$99.990

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Kepictronics

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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20,000

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Metaverse IC Inc.

Canada . 20,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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20,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

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Technical Specifications

Graphics Display Drivers IW3602-31 attributes and parameters. Explore more Graphics Display Drivers devices from Dialog Semiconductor

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

16 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

IW3602-31 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Dialog Semiconductor

TOKYO, Japan, August 31, 2021 JST | LONDON, United Kingdom, August 31, 2021 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Dialog Semiconductor Plc (“Dialog”), a leading provider of battery and power management, Wi-Fi, Bluetooth® low energy and Industrial edge computing solutions, today announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog. Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen.

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