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14250R-300

Dialog Semiconductor

14250R-300 by Dialog Semiconductor

DATACOM TRANSFORMER; Mounting Feature: SURFACE MOUNT; Approvals (V): UL; CSA; TUV; No. of Functions: 1; Width: 14.22 mm; Minimum Operating Temperature: -40 Cel;

Median Price

$10.711

Lifecycle Status

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DigiKey

USA . 4,500 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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$63.000

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$57.960

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ComSIT Distribution GmbH

Germany . 58 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 41 parts In-Stock

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J2 Sourcing AB

Sweden . 14 parts In-Stock

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PC Components Company LLC

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NexGen Digital

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Perfect Parts

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Glotronic Ltd.

UK . 2,300 parts In-Stock

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Kepictronics

USA . 600 parts In-Stock

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Technical Specifications

Pulse & Datacom Transformers 14250R-300 attributes and parameters. Explore more Pulse & Datacom Transformers devices from Dialog Semiconductor

Specs

Application:

GENERAL PURPOSE

Approvals (V):

Height:

8.18 mm

Length:

16.77 mm

Mounting Feature:

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Dimensions:

L16.77XB14.22XH8.18 (mm)

Transformer Type:

Width:

14.22 mm

Trade Compliance

14250R-300 Transformers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Dialog Semiconductor

TOKYO, Japan, August 31, 2021 JST | LONDON, United Kingdom, August 31, 2021 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Dialog Semiconductor Plc (“Dialog”), a leading provider of battery and power management, Wi-Fi, Bluetooth® low energy and Industrial edge computing solutions, today announced the successful completion of Renesas’ acquisition of the entire issued and to be issued share capital of Dialog. Renesas will fund the cash consideration payable to Dialog shareholders of approximately EUR 4.8 billion (approximately 624.0 billion yen at an exchange rate of 130 yen to the Euro) through a combination of debt, cash on hand and the proceeds of an equity offering of approximately 222.6 billion yen.

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