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CYD36S36V18-167BBXC

Cypress Semiconductor

CYD36S36V18-167BBXC by Cypress Semiconductor

MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 471 parts In-Stock

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471

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Digiode

USA . 245 parts In-Stock

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245

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Northwest PG Solutions

USA . 1,731 parts In-Stock

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$2.875

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1,731

$2.875

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Modulus Dynamics

Lithuania . 2,931 parts In-Stock

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$4.874

100+ parts

$4.679

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$4.484

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2,931

$4.874

$4.679

$4.484

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Microchip USA

USA . 489 parts In-Stock

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489

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Corphita

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460

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Native Components

USA . 137 parts In-Stock

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$2.536

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137

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$2.536

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Technical Specifications

SRAM CYD36S36V18-167BBXC attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

4 ns

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23 mm

Memory Density:

37748736 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

484

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX36

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage (Vsup):

1.58 V

Minimum Supply Voltage (Vsup):

1.42 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

CYD36S36V18-167BBXC Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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