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CY7C1062GE30-10BGXI

Cypress Semiconductor

CY7C1062GE30-10BGXI by Cypress Semiconductor

STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: HBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$36.614

Lifecycle Status

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11

In-Stock Inventory

1k+

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Mouser Electronics

USA . 11 parts In-Stock

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$43.390

100+ parts

$35.640

1k+ parts

$33.730

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11

$43.390

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$33.730

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Flip Electronics (Authorized)

USA . 4,453 parts In-Stock

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Rochester

USA . 193 parts In-Stock

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$30.250

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$27.060

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$25.470

193

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$25.470

Verical

USA . 151 parts In-Stock

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$39.487

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$35.712

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DigiKey

USA . 55 parts In-Stock

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$33.740

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Digiode

USA . 493 parts In-Stock

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$31.930

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Vyrian

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Flip Electronics

USA . 1,903 parts In-Stock

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Component Sense

UK . 113 parts In-Stock

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Netsource Technology, Inc.

USA . 19 parts In-Stock

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LWI Electronics Inc

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Northwest PG Solutions

USA . 1,036 parts In-Stock

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$2.893

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$2.893

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Corphita

USA . 731 parts In-Stock

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$30.249

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Modulus Dynamics

Lithuania . 1,093 parts In-Stock

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$34.485

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$33.106

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$31.726

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Component Stockers USA

USA . 408 parts In-Stock

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$42.280

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$32.300

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QUARKTWIN TECHNOLOGY LTD

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Native Components

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$2.551

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955

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Technical Specifications

SRAM CY7C1062GE30-10BGXI attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PBGA-B119

JESD-609 Code:

e1

Length:

22 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

119

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

14 mm

Trade Compliance

CY7C1062GE30-10BGXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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