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HCPL-7840#560

Broadcom

HCPL-7840#560 by Broadcom

ISOLATION AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 239 parts In-Stock

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239

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Digiode

USA . 75 parts In-Stock

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75

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Northwest PG Solutions

USA . 2,350 parts In-Stock

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$3.315

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2,350

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Microchip USA

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Decca Corp

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$14.000

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$13.720

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$13.583

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1,097

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Glotronic Ltd.

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Supply Digital

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2,654

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Native Components

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$2.923

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Corphita

USA . 327 parts In-Stock

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Technical Specifications

Isolation Amplifiers HCPL-7840#560 attributes and parameters. Explore more Isolation Amplifiers devices from Broadcom

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

1

Sub-Category:

Isolation Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

100 MHz

Maximum Common Mode Voltage:

2.8 V

Minimum Voltage Gain:

7.6

Maximum Voltage Gain:

8.4

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

15.5 mA

Minimum Isolation Voltage:

3.75 KV

Physical Characteristics

Length:

0.386 in (9.8 mm)

Width:

0.25 in (6.35 mm)

Maximum Seated Height:

0.146 in (3.7 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

GWDIP8,.4

Trade Compliance

HCPL-7840#560 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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