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BCM53118KQLEG

Broadcom

BCM53118KQLEG by Broadcom

ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 256; Package Code: HLFQFP; Package Shape: SQUARE;

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Vyrian

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LWI Electronics Inc

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ECAB

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Bristol Electronics

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Bas Electronics GmbH & Co. KG

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Cyclops Electronics Ltd

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Andel Nordic

Denmark . 5,078 parts In-Stock

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Native Components

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Northwest PG Solutions

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Decca Corp

Germany . 639 parts In-Stock

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AZTECH Wire

Italy . 340 parts In-Stock

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Vigor

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Microchip USA

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A-Z Elektronik GmbH

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Corphita

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GreenTree Electronics

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ChipstoGo Electronic ltd

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Technical Specifications

Network Interfaces BCM53118KQLEG attributes and parameters. Explore more Network Interfaces devices from Broadcom

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

S-PQFP-G256

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP256,1.2SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

BCM53118KQLEG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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