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529802B02500G

Boyd

529802B02500G by Boyd

Boyd 529802B02500G Heat Sink has Thermal Resistance of 3.7 ohm, Height 38.1mm, and Length 41.91mm. Ideal for cooling electronic components in compact spaces with radial fin orientation and anodized black finish.

Median Price

$4.090

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

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Sager

USA . 8,231 parts In-Stock

1+ parts

$1.570

100+ parts

-

1k+ parts

$1.460

10k+ parts

$1.330

8,231

$1.570

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$1.460

$1.330

Interstate Connecting

USA . 343 parts In-Stock

1+ parts

$2.075

100+ parts

$1.794

1k+ parts

$1.604

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343

$2.075

$1.794

$1.604

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DigiKey

USA . 7,402 parts In-Stock

1+ parts

$2.190

100+ parts

$1.777

1k+ parts

$1.566

10k+ parts

$1.390

7,402

$2.190

$1.777

$1.566

$1.390

Mouser Electronics

USA . 3,530 parts In-Stock

1+ parts

$2.190

100+ parts

$1.780

1k+ parts

$1.560

10k+ parts

$1.390

3,530

$2.190

$1.780

$1.560

$1.390

Heilind Electronics

USA . 451 parts In-Stock

1+ parts

$3.472

100+ parts

$2.862

1k+ parts

$11.343

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451

$3.472

$2.862

$11.343

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Newark

USA . 699 parts In-Stock

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$5.080

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$5.080

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Farnell

UK . 759 parts In-Stock

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$8.778

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759

$8.778

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Element14

Singapore . 501 parts In-Stock

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$21.520

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$13.000

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501

$21.520

$13.000

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Future Electronics

Canada . 75,844 parts In-Stock

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$4.090

1k+ parts

$4.000

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$4.000

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Master Electronics

USA . 6,292 parts In-Stock

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$1.560

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$1.420

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$1.420

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Arrow

USA . 5,809 parts In-Stock

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$8.438

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$8.438

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Verical

USA . 5,809 parts In-Stock

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$8.438

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5,809

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$8.438

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Avnet

USA . 1,055 parts In-Stock

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$9.350

10k+ parts

$1.360

1,055

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$9.350

$1.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 66 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

10k+ parts

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66

$2.310

$1.730

$1.500

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Voyager Components

USA . 9 parts In-Stock

1+ parts

$3.854

100+ parts

$3.854

1k+ parts

$3.854

10k+ parts

$3.854

9

$3.854

$3.854

$3.854

$3.854

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.490

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50

$7.490

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IBS Electronics

USA . 76,815 parts In-Stock

1+ parts

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100+ parts

$5.736

1k+ parts

$8.752

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76,815

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$5.736

$8.752

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NAC Semi

USA . 61,920 parts In-Stock

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$7.050

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61,920

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$7.050

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Vyrian

USA . 4,171 parts In-Stock

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Bristol Electronics

USA . 2,590 parts In-Stock

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Electro Sonic

Canada . 1,126 parts In-Stock

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$4.190

1k+ parts

$3.400

10k+ parts

$1.330

1,126

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$4.190

$3.400

$1.330

Goldney Electronics S.L.

Spain . 500 parts In-Stock

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Atlantic Semiconductor

USA . 338 parts In-Stock

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ComSIT Distribution GmbH

Germany . 316 parts In-Stock

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Semtec, LLC

USA . 158 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Technoshack Inc.

Canada . 30 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Component Stockers USA

USA . 56,908 parts In-Stock

1+ parts

$1.350

100+ parts

$1.290

1k+ parts

$1.250

10k+ parts

$1.270

56,908

$1.350

$1.290

$1.250

$1.270

Aranea Global

USA . 100 parts In-Stock

1+ parts

$7.341

100+ parts

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$7.047

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100

$7.341

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$7.047

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Continental Prestige Electronics

USA . 105 parts In-Stock

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$9.990

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Perfect Parts

USA . 15,960 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,304 parts In-Stock

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Argo Parts USA

USA . 2,243 parts In-Stock

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USA . 6 parts In-Stock

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Overview

Enhance your electronic devices' performance with the top-of-the-line 529802B02500G heat sink by Boyd. Crafted with precision and expertise, this heat sink offers unparalleled thermal resistance of 3.7 ohm, ensuring optimal cooling for your components. Whether you're a tech enthusiast or a professional in need of reliable thermal management solutions, this product is designed to meet your needs. Elevate your devices' efficiency and longevity with Boyd's cutting-edge heat sink technology.

Feature Benefit Bullets

Thermal Resistance: 3.7 ohm

Lower thermal resistance indicates better heat dissipation efficiency, ensuring optimal cooling for electronic components.

Thermal Device Type: HEAT SINK

Being a dedicated heat sink, this product is specifically designed to efficiently dissipate heat generated by electronic devices, ensuring their longevity and performance.

Height: 38.1 mm

The height of 38.1 mm allows for a sufficient surface area for heat dissipation, making it suitable for managing thermal loads effectively.

Finish: ANODIZED

Anodized finish provides corrosion resistance and enhances the durability of the heat sink, making it a reliable choice for long-term use.

Width: 25.4 mm

Width of 25.4 mm ensures compatibility with various electronic devices while providing adequate heat dissipation capabilities.

Construction: EXTRUDED

The extruded construction offers superior structural integrity and thermal conductivity, making this heat sink a reliable and efficient cooling solution.

Color: BLACK

Black color not only gives a sleek and professional look to the heat sink but also enhances heat absorption properties, aiding in efficient thermal management.

Fin Orientation: RADIAL

Radial fin orientation allows for better airflow and heat dissipation, optimizing thermal performance and maintaining lower operating temperatures.

Body Material: ALUMINUM

Aluminum is known for its excellent thermal conductivity, lightweight nature, and corrosion resistance, making it an ideal material choice for efficient heat sinks.

Length: 41.91 mm

The length of 41.91 mm provides sufficient surface area for heat transfer, ensuring effective cooling of electronic components and preventing overheating issues.

Technical Specifications

Heat Sinks 529802B02500G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin Orientation:

Physical Specifications

Height:

1.5 in (38.1 mm)

Width:

1 in (25.4 mm)

Length:

1.65 in (41.91 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

3.7 Ω

Usage and Compatibility

Device Type:

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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