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374324B00032G

Boyd

374324B00032G by Boyd

HEAT SINK; Profile: PIN FIN ARRAY; Body Material: ALUMINUM; Device Used On: IC; Construction: FIN; Fin Orientation: OMNIDIRECT;

Median Price

$0.327

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 352 parts In-Stock

1+ parts

$0.327

100+ parts

$0.327

1k+ parts

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10k+ parts

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352

$0.327

$0.327

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Mouser Electronics

USA . 1,168 parts In-Stock

1+ parts

$2.250

100+ parts

$1.890

1k+ parts

$1.530

10k+ parts

$1.470

1,168

$2.250

$1.890

$1.530

$1.470

Verical

USA . 352 parts In-Stock

1+ parts

-

100+ parts

$0.327

1k+ parts

-

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352

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$0.327

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 1,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.670

10k+ parts

$2.470

1,344

-

-

$2.670

$2.470

Elcom Components

USA . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 3,169 parts In-Stock

1+ parts

$0.780

100+ parts

$0.740

1k+ parts

$1.470

10k+ parts

-

3,169

$0.780

$0.740

$1.470

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Abacus Technologies

USA . 2,016 parts In-Stock

1+ parts

-

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2,016

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Kepictronics

USA . 545 parts In-Stock

1+ parts

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545

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Perfect Parts

USA . 111 parts In-Stock

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111

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Technical Specifications

Heat Sinks 374324B00032G attributes and parameters. Explore more Heat Sinks devices from Boyd

Device Specifications

Construction:

Fin

Profile:

Fin Orientation:

Physical Specifications

Height:

0.394 in (10 mm)

Width:

1.063 in (27 mm)

Length:

1.063 in (27 mm)

Material and Finish

Finish:

Anodized

Body Material Composition:

Color:

Black

Thermal Specifications

Thermal Resistance:

30.6 Ω

Usage and Compatibility

Device Type:

Compatible Device:

IC

Manufacturer Highlights

Boyd

Boyd is the world's leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years. Innovation demands for smaller, lighter, and faster technologies with intuitive new features compete with the need for more sustainable solutions. More smart functionality operating faster in tighter spaces with more sophisticated interfaces mean increased power density and more heat, electrical, and mechanical challenges. Adding further complexity, devices are used in unpredictable environments with harsh conditions and must be contaminant and waterproof, insulated against temperature extremes, and ruggedized. Not only are we determined to find solutions to these challenges, Boyd strives to simplify where possible and create the most wholistic, effective, and sustainable solutions.

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