Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Aries Electronics 22-1508-30 is a DIP32 IC socket with 22 contacts, rated at 3A current. It features wire wrap termination, gold finish over nickel mating contact, and nylon46 housing material. Used for chip carrier components on PCBs with rectangular contact pattern and 2.54mm pitch row spacing.
Median Price
$0.937
Lifecycle Status
Suppliers In-Stock
32
In-Stock Inventory
1k+
Boersig
1+ parts
$0.696
100+ parts
-
1k+ parts
10k+ parts
Bürklin Elektronik
$0.930
$0.730
$0.700
Mouser Electronics
$1.980
$1.530
$1.140
$0.902
Newark
$2.230
$1.720
$1.540
$1.310
Element14
$4.410
$3.350
$2.840
$2.710
Chip1Stop
$0.543
Arrow
$0.601
Verical
$0.595
TTI Europe
$0.652
Farnell
$0.944
Master Electronics
$1.190
$1.160
Powell Electronics
$0.990
RS Americas
NEP Electronics
Digiode
$0.661
Maritex
$1.188
$0.511
TME
$2.290
$2.070
$1.180
$0.850
Famous Connections Ltd
Vyrian
LIBRA Elektronik GmbH
Rapid Electronics
IBS Electronics
$1.669
$1.627
NAC Semi
$0.852
Chip Stock
A&K Electronics
Rotakorn
Bristol Electronics
Schukat
$0.822
$0.628
VNN
Nova Conductors
J2 Sourcing AB
Mil-Aero Solutions, Inc.
Semicontronic
$0.462
$0.450
$0.448
Corphita
$0.626
Continental Prestige Electronics
$1.400
$1.050
$0.856
Assy Fe
Glotronic Ltd.
Kepictronics
Robosynatics
$8.039
$7.875
Lucentia Tech
Abacus Technologies
EMSNET (Excess)
Argo Parts USA
Bastille Electronics
ErreBi Group
Authorized Procurement Solutions
The standard PCB contact row spacing of 2.54mm makes it compatible with a wide range of PCB designs and layouts.
The housing material used is NYLON46, which provides durability and resilience to the product.
With wire wrap termination type, it ensures secure connections and ease of installation.
Having 22 contacts allows for versatile connectivity options and compatibility with a variety of devices.
The current rating of 3A ensures reliable power transmission and usage in various electronic applications.
The gold finish over nickel mating contact provides excellent conductivity and corrosion resistance for long-term performance.
Being an IC socket type, it offers easy insertion and removal of integrated circuits for efficient testing and maintenance.
With a maximum operating temperature of 105°C, this product is suitable for use in high-temperature environments without compromising performance.
Chip Carrier IC & Component Sockets 22-1508-30 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Aries Electronics
Number of Positions or Pins:
Contact Finish - Mating:
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JESD-609 Code:
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22-1508-30 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
Micro Commercial Components
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Continental Device India
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
PL11-Q
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
08-350000-11-RC
Aries Electronics
IC SOCKET; Device Type Used On: SOIC8-DIP8; Contact Finish (Mating): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: SOCKET ADAPTER; No. of Contacts: 8;
XR2A-2221-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
VCF4-1000
TE Connectivity
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 1;
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
3-822472-3
TE Connectivity's 3-822472-3 is a PLCC32 chip carrier socket with 32 contacts, P-CUSN contact material, and -55 to 105°C operating temperature range. Ideal for surface mount applications in IC sockets, it features bellowed type contacts and a dielectric voltage rating of 600VAC.
ICF-640-S-O
Samtec
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
XR2A-2021-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Manufacturer Series: XR2A;
1419111-2
RELAY SOCKET; Housing Material: STAINLESS STEEL; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2B-4011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
1860991-1
IC SOCKET; Housing Material: POLYAMIDE; No. of Contacts: 8; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
8448-001
Amphenol Communications Solutions
Amphenol's 8448-001 IC Socket features staggered contact configuration with 335 contacts on a LGA335 device. With a PCB row spacing of 1.27mm and surface mount termination, it is ideal for straight mounting on PCBs. The socket uses glass-filled polyetherimide housing material for durability in electronic applications.
1571552-4
TE Connectivity's 1571552-4 is a chip carrier IC socket with PCB contact row spacing of 7.62mm and rectangular contact pattern. It is made of thermoplastic polyester and used on DIP16 devices. With a rating of 3A, it has a max operating temperature of 105°C and insulation resistance of 5GΩ.
2-1571550-9
TE Connectivity's 2-1571550-9 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and uses solder termination. With a housing made of polyethylene, it operates b/w -55°C to 105°C, suitable for various electronic applications requiring reliable connections.
818-22-016-10-000101
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
PTF08A
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
XR2A-4202
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
2-1571552-5
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
HLT-1910-T-R
The Samtec HLT-1910-T-R is a plastic IC socket with 190 brass contacts, featuring Tin over Nickel mating finish. Designed for PGA190 devices, it offers reliable connectivity and durability in chip carrier applications. Ideal for high-performance electronic systems requiring secure component sockets.
ICF-624-F-O
Samtec's ICF-624-F-O is a Chip Carrier IC Socket with 24 contacts, 15.24mm PCB row spacing, and liquid crystal polymer housing. It features gold flash over nickel contact finish, suitable for DIP24 devices in applications requiring a current rating of 1A and operating temperatures from -55°C to 125°C.
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22-1518-10HE
IC SOCKET; Device Type Used On: DIP22; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON; Terminal Pitch (mm): 2.54;
22-1508-20
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Finish (Mating): GOLD (10) OVER NICKEL;
22-1508-21
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; PCB Contact Pattern: RECTANGULAR;
22-1508-31
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Length: 1.1 inch;
22-1518-00
IC SOCKET; Device Type Used On: DIP22; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Body Depth: .1 inch;
22-1518-10E
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Maximum Operating Temperature: 105 Cel;
22-1518-10H
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; No. of Contacts: 22;
22-1518-10
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; PCB Contact Row Spacing (mm): 2.54;
22-1518-11E
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Width: .2 inch;
22-1518-11H
22-1518-11
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Rating (Current): 3 A;
Supply Digital Components
$106.00
$54.25
$11.90
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12,000 In-Stock
Total price ≈ $80,197.29
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