Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Anaren's RFP-60-50TPC RF/Microwave Termination handles up to 47.78 dBm CW power with VSWR of 1.25, ideal for frequencies from 0-6000 MHz. Its module construction and silver terminal finish ensure reliable performance in temperatures ranging from -55 to 150°C.
Median Price
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Argo Parts USA
High power handling capability allows for use in applications with high power levels.
Low VSWR ensures efficient power transfer and minimal reflections in the RF system.
Module construction provides ease of integration and installation in various setups.
Wide operating temperature range makes it suitable for extreme environmental conditions.
Ability to function in extremely low temperatures expands application versatility.
Silver terminal finish ensures high conductivity and durability for long-term reliability.
Specifically designed for terminating RF and microwave signals, ensuring optimal system performance.
Compatible with standard 50 ohm systems, allowing for seamless integration into existing setups.
Broad frequency range capability enables use across various RF and microwave applications.
High frequency handling makes it suitable for broadband applications with wide frequency ranges.
RF/Microwave Terminations RFP-60-50TPC attributes and parameters. Explore more RF/Microwave Terminations devices from Anaren
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
JESD-609 Code:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
RF or Microwave Device Type:
Terminal Finish:
Maximum Voltage Standing Wave Ratio:
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Littelfuse
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
MMBF170LT1G
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Daco Semiconductor
Electronic Transistors
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
1436
Aeroflex/weinschel
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 3000 MHz; Maximum Input Power (CW): 31.76 dBm; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.15;
FT10515N0050J02
American Technical Ceramics
RF/MICROWAVE TERMINATION;
CT1005
Emc Technology & Florida Rf Labs
RF/MICROWAVE TERMINATION; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 41.76 dBm; Maximum Voltage Standing Wave Ratio: 1.25; Terminal Finish: Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Minimum Operating Temperature: -55 Cel;
5663
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 59.03 dBm; Construction: MODULE; Characteristic Impedance: 50 ohm; JESD-609 Code: e0; Maximum Voltage Standing Wave Ratio: 1.5;
LT12525T0050J02
RF/MICROWAVE TERMINATION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 1; Screening Level: MIL-PRF-55342; JESD-609 Code: e4; Maximum Operating Temperature: 150 Cel;
LT12525T0050J01
RF/MICROWAVE TERMINATION; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Maximum Operating Temperature: 150 Cel; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 50 dBm;
1445-1
Api Technologies
RF/MICROWAVE TERMINATION; Minimum Operating Temperature: -55 Cel; Construction: MODULE; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 40000 MHz; Maximum Voltage Standing Wave Ratio: 1.35;
RFP-250-50TC
Anaren
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.3; Maximum Operating Temperature: 150 Cel; Maximum Input Power (CW): 53.98 dBm; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz;
4910
RF/MICROWAVE TERMINATION; JESD-609 Code: e0; Maximum Operating Frequency: 18000 MHz; Characteristic Impedance: 50 ohm; Maximum Voltage Standing Wave Ratio: 1.3; Terminal Finish: Tin/Lead (Sn/Pb);
RF/MICROWAVE TERMINATION; Minimum Operating Temperature: -55 Cel; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 36.99 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Temperature: 125 Cel;
M39030/3-11N
Bel Fuse
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.15; Maximum Input Power (CW): 30 dBm; Maximum Operating Frequency: 18000 MHz; Characteristic Impedance: 50 ohm; Construction: COAXIAL;
CZ12010T0050GTR
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 40 dBm; Maximum Voltage Standing Wave Ratio: 1.2; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
250-50TC
Ttm Technologies
The Ttm Technologies 250-50TC is an RF/Microwave Termination with a max input power of 53.98 dBm and VSWR of 1.3. It operates b/w -55°C to 150°C, covering frequencies from 0 MHz to 3000 MHz. Ideal for applications requiring high power handling and precise impedance matching in RF/microwave systems.
1426
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Additional Features: N, I/P POWER-MAX(PEAK)=5000W; Construction: COAXIAL; Maximum Operating Frequency: 8500 MHz; Maximum Voltage Standing Wave Ratio: 1.3;
8465
Smiths Group Plc
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 150 Cel; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
1442
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.3; Maximum Input Power (CW): 50 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 8500 MHz; Additional Features: N, I/P POWER-MAX(PEAK)=5000W;
3008
Aeroflex Plainview
RF/MICROWAVE TERMINATION; Minimum Operating Temperature: -65 Cel; Maximum Operating Temperature: 125 Cel; Characteristic Impedance: 50 ohm; Additional Features: SMA-F; SMA-M; JESD-609 Code: e4;
SHT-2173-F0-BMA-02
Midwest Microwave
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Maximum Input Power (CW): 43.01 dBm; Maximum Operating Temperature: 125 Cel; Characteristic Impedance: 50 ohm;
Vertiv
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 33.01 dBm; Construction: COAXIAL; Minimum Operating Frequency: 0 MHz; Additional Features: SMA-M; Maximum Operating Frequency: 18000 MHz;
1439
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 2500 MHz; Maximum Input Power (CW): 51.76 dBm; Maximum Voltage Standing Wave Ratio: 1.2; Additional Features: N, I/P POWER-MAX(PEAK)=10000W; Construction: COAXIAL;
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RFP-60-50TP-S
RF/MICROWAVE TERMINATION; Construction: COMPONENT; Maximum Input Power (CW): 47.78 dBm; Maximum Operating Temperature: 150 Cel; Maximum Operating Frequency: 6000 MHz; Maximum Voltage Standing Wave Ratio: 1.25;
RFP-60-50TPR-S
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Minimum Operating Temperature: -55 Cel; Maximum Voltage Standing Wave Ratio: 1.25; Maximum Operating Frequency: 6000 MHz; Construction: COMPONENT;
RFP-60-50TPR
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 6000 MHz; Construction: COMPONENT;
RFP-60-50TP
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 6000 MHz; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Maximum Input Power (CW): 47.78 dBm; Construction: MODULE;
RFP-60N50TPC
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Construction: MODULE; Maximum Input Power (CW): 47.78 dBm; Minimum Operating Temperature: -55 Cel; Maximum Voltage Standing Wave Ratio: 1.25;
RFP-60N50TPR
RF/MICROWAVE TERMINATION; Minimum Operating Temperature: -55 Cel; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Operating Temperature: 150 Cel; Maximum Input Power (CW): 47.78 dBm;
RFP-60H50TPC
RF/MICROWAVE TERMINATION; Characteristic Impedance: 50 ohm; Construction: MODULE; Maximum Voltage Standing Wave Ratio: 1.3; Maximum Input Power (CW): 47.78 dBm; Maximum Operating Frequency: 6000 MHz;
RFP-60H50TPR
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 47.78 dBm; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -55 Cel; Maximum Operating Frequency: 6000 MHz; Maximum Voltage Standing Wave Ratio: 1.3;
RFP-60N50TP
RF/MICROWAVE TERMINATION; Maximum Operating Temperature: 150 Cel; Construction: MODULE; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -55 Cel; Maximum Input Power (CW): 47.78 dBm;
RF/MICROWAVE TERMINATION; Maximum Input Power (CW): 47.78 dBm; Maximum Voltage Standing Wave Ratio: 1.25; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 6000 MHz; Minimum Operating Temperature: -55 Cel;
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -55 Cel; Construction: MODULE; Maximum Input Power (CW): 47.78 dBm;
RF/MICROWAVE TERMINATION; Maximum Voltage Standing Wave Ratio: 1.25; Maximum Input Power (CW): 47.78 dBm; Construction: MODULE; Minimum Operating Frequency: 0 MHz; Characteristic Impedance: 50 ohm;
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 4000 MHz; Minimum Operating Temperature: -55 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 150 Cel; Maximum Input Power (CW): 47.78 dBm;
RF/MICROWAVE TERMINATION; Characteristic Impedance: 50 ohm; Maximum Voltage Standing Wave Ratio: 1.3; Construction: MODULE; Minimum Operating Frequency: 0 MHz; Minimum Operating Temperature: -55 Cel;
RF/MICROWAVE TERMINATION; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.3; Maximum Operating Temperature: 250 Cel; Maximum Input Power (CW): 47.78 dBm; Construction: MODULE;
RF/MICROWAVE TERMINATION; Construction: MODULE; Maximum Operating Temperature: 150 Cel; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 0 MHz; Maximum Input Power (CW): 47.78 dBm;
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 6000 MHz; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.25; Maximum Input Power (CW): 47.78 dBm;
RF/MICROWAVE TERMINATION; Maximum Operating Frequency: 6000 MHz; Maximum Operating Temperature: 150 Cel; Construction: COMPONENT; Maximum Voltage Standing Wave Ratio: 1.25; Maximum Input Power (CW): 47.78 dBm;
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