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MX767JP

Analog Devices

MX767JP by Analog Devices

Analog Devices' MX767JP is a 12-bit D/A converter with 0.02% linearity error and 4us settling time. Ideal for commercial applications, it operates at temperatures from 0 to 70 °C with +-12/+-15V power supplies. The chip carrier package has 28 terminals in a square shape, making it suitable for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,319 parts In-Stock

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Vyrian

USA . 1,977 parts In-Stock

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Digiode

USA . 1,004 parts In-Stock

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One Stop Electronics

USA . 1,953 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 742 parts In-Stock

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$8.991

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742

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Semicontronic

India . 646 parts In-Stock

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$9.000

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$8.775

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$8.730

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646

$9.000

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MARBEL Systems

Belgium . 2,281 parts In-Stock

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$9.106

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Texas Native Microelectronics

USA . 10 parts In-Stock

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$10.467

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$10.048

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$9.734

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$9.211

10

$10.467

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$9.211

Kenton Components

USA . 3,424 parts In-Stock

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$12.560

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$11.053

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Qasali Group International

UK . 3,380 parts In-Stock

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$28.261

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$26.283

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$24.870

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Corphita

USA . 2,291 parts In-Stock

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Overview

Unleash the power of precise digital-to-analog conversion with the MX767JP by Analog Devices. Crafted with top-notch quality and expertise, this cutting-edge converter offers unparalleled performance in a wide range of applications. Whether you're in the field of audio equipment, industrial automation, or telecommunications, this versatile device delivers exceptional value and accuracy with its 12-bit resolution and minimal linearity error. Say goodbye to compromise and experience the benefits of seamless integration and reliable operation with the MX767JP. Elevate your projects to new heights with this game-changing solution from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the digital-to-analog converter.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and simplifying the manufacturing process.

No. of Bits: 12

With a higher number of bits, this digital-to-analog converter can provide more precise and accurate conversion of digital signals to analog signals.

Maximum Settling Time: 4 us

A fast settling time ensures quick and reliable conversion of signals, making this product suitable for real-time applications.

Maximum Linearity Error (EL): 0.02 %

The low linearity error ensures that the output analog signal closely follows the input digital signal, resulting in high accuracy and fidelity.

Power Supplies (V): +-12/+-15

The wide range of power supply voltages supported makes this digital-to-analog converter versatile and compatible with different systems.

No. of Terminals: 28

The 28 terminals provide ample connectivity options, allowing for easy integration with other components and circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and efficient, making it suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this digital-to-analog converter can operate effectively in a wide range of temperatures.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections.

Technology: BIPOLAR

The use of bipolar technology enables high-speed and high-precision analog signal conversion, making this product suitable for demanding applications.

Maximum Supply Current: 12 mA

With a relatively low maximum supply current, this digital-to-analog converter is energy-efficient and suitable for battery-powered devices.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter, this product is essential for converting digital signals from microcontrollers or processors into analog signals for various applications.

Input Bit Code: BINARY, OFFSET BINARY

Support for binary and offset binary input bit codes provides flexibility in signal processing and compatibility with different systems.

Technical Specifications

Digital-to-Analog Converters MX767JP attributes and parameters. Explore more Digital-to-Analog Converters devices from Analog Devices

Converter Specifications

Technology:

Bipolar

Sub-Category:

Other Converters

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.02 %

Maximum Supply Current:

12 mA

Maximum Settling Time:

4 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Power Supplies:

±12/±15 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Tin Lead

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Trade Compliance

MX767JP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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