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MAX626MJA/883

Analog Devices

MAX626MJA/883 by Analog Devices

MAX626MJA/883 by Analog Devices is a MILITARY-grade MOSFET Gate Driver with 8 terminals, operating b/w -55 to 125 °C. It has a power supply range of 4.5-18V and uses BUFFER OR INVERTER BASED technology for various applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,220 parts In-Stock

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9,220

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Anansix

USA . 2,761 parts In-Stock

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2,761

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Digiode

USA . 1,418 parts In-Stock

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1,418

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Distributors (Availability)

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MARBEL Systems

Belgium . 17 parts In-Stock

1+ parts

$4.547

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17

$4.547

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Texas Native Microelectronics

USA . 86 parts In-Stock

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$5.227

100+ parts

$5.018

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$4.861

10k+ parts

$4.600

86

$5.227

$5.018

$4.861

$4.600

Kenton Components

USA . 1,032 parts In-Stock

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$6.272

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$5.520

1,032

$6.272

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$5.520

One Stop Electronics

USA . 2,512 parts In-Stock

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$7.500

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2,512

$7.500

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AZTECH Wire

Italy . 314 parts In-Stock

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$12.681

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314

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Qasali Group International

UK . 916 parts In-Stock

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$14.113

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$13.125

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$12.419

916

$14.113

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$13.125

$12.419

Semicontronic

India . 1,124 parts In-Stock

1+ parts

$42.500

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$41.438

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$41.225

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1,124

$42.500

$41.438

$41.225

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Corphita

USA . 1,587 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MAX626MJA/883 by Analog Devices. Manufactured with top-notch quality and reliability, this MOSFET Gate Driver is designed to meet stringent military standards, ensuring durability in harsh environments. Ideal for applications requiring high-speed switching and efficient power management, this product offers unmatched value by delivering superior performance and precision. Trust Analog Devices to provide cutting-edge technology that empowers your projects to reach new heights of efficiency and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides high thermal conductivity and reliability, making it suitable for high-temperature applications.

Screening Level: 38535Q/M;38534H;883B

This screening level ensures that the product meets stringent quality standards and is suitable for military and aerospace applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting in electronic circuits.

Power Supplies (V): 4.5/18

Wide range of power supply voltage allows for flexibility in different applications and power requirements.

No. of Terminals: 8

Sufficient number of terminals for connecting to external components and circuitry.

Package Style (Meter): IN-LINE

In-line package style is compact and space-saving, suitable for applications with size constraints.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in elevated temperature environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality in cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and connections.

Temperature Grade: MILITARY

Military grade temperature range ensures reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure mechanical mounting and easy soldering.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy connection to standard PCB layouts.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Buffer or inverter based MOSFET driver offers flexibility in driving MOSFETs with varying requirements.

Technical Specifications

MOSFET Gate Drivers MAX626MJA/883 attributes and parameters. Explore more MOSFET Gate Drivers devices from Analog Devices

Specs

JESD-30 Code:

R-XDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/18

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

MOSFET Drivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

MAX626MJA/883 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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