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HMC423MS8TR

Analog Devices

HMC423MS8TR by Analog Devices

Analog Devices' HMC423MS8TR is a GAAS RF/Microwave Mixer with 50 ohm impedance, operating from 600 MHz to 1300 MHz. It offers a max conversion loss of 11 dB and can handle up to 13 dBm CW input power. Ideal for applications requiring double balanced mixers in surface mount packages.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,829 parts In-Stock

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Digiode

USA . 553 parts In-Stock

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Parana Technologies

USA . 701 parts In-Stock

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$2.708

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$2.519

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701

$2.708

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IDEA Electronic Components Group

UK . 106 parts In-Stock

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$2.912

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$2.766

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DigiPath Technology Company

USA . 1,591 parts In-Stock

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$4.543

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$4.361

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AZTECH Wire

Italy . 474 parts In-Stock

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Ampacity Inc.

Singapore . 802 parts In-Stock

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$23.000

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One Stop Electronics

USA . 1,633 parts In-Stock

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Semicontronic

India . 1,491 parts In-Stock

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$27.160

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QUARKTWIN TECHNOLOGY LTD

USA . 7,662 parts In-Stock

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Corphita

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Metaverse IC Inc.

Canada . 350 parts In-Stock

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Overview

Unlock the power of RF/Microwave technology with the HMC423MS8TR from Analog Devices. With a reputation for excellence in the industry, Analog Devices delivers top-quality products that exceed expectations. This versatile mixer offers high performance and reliability, making it the ideal choice for a wide range of applications. From communication systems to radar and more, the HMC423MS8TR provides unparalleled value, benefits, and advantages to customers seeking cutting-edge solutions. Upgrade your systems today with the HMC423MS8TR and experience the difference Analog Devices can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective, ideal for applications where weight and cost are important considerations.

Maximum Input Power (CW): 13 dBm

The high maximum input power handling capability of 13 dBm ensures reliable performance even under high-power operation, making it suitable for demanding RF/microwave applications.

Construction: COMPONENT

Being a component-type device, it can easily be integrated into existing circuit designs, offering flexibility and versatility in system implementations.

Power Supplies (V): 3

The low power supply requirement of 3V minimizes power consumption, making it energy-efficient and suitable for battery-operated devices.

No. of Terminals: 8

The presence of 8 terminals provides sufficient connectivity options, allowing for versatile connectivity configurations in RF/microwave circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand elevated temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures operational reliability even in harsh cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The use of tin-lead terminal finish improves solderability and conductivity, enhancing the reliability and longevity of the product in circuit connections.

Technology: GAAS

The gallium arsenide (GaAs) technology offers high-frequency performance, low noise characteristics, and high linearity, making it ideal for RF/microwave applications that require high performance.

RF or Microwave Device Type: DOUBLE BALANCED

The double-balanced design helps reduce spurious signals and intermodulation distortion, ensuring clean and accurate RF/microwave signal processing.

Characteristic Impedance: 50 ohm

The 50-ohm characteristic impedance matches standard RF transmission lines, enabling seamless integration into existing RF systems without impedance mismatches.

Maximum Conversion Loss: 11 dB

The low maximum conversion loss of 11 dB ensures minimal signal loss during signal conversion, maintaining signal integrity and fidelity in RF/microwave systems.

Minimum Operating Frequency: 600 MHz

The low minimum operating frequency of 600 MHz makes the product suitable for a wide range of RF/microwave applications requiring lower frequency operation.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Operating Frequency: 1300 MHz

The high maximum operating frequency of 1300 MHz enables the product to support high-frequency RF/microwave signals, making it suitable for applications requiring high-frequency operation.

Technical Specifications

RF/Microwave Mixers HMC423MS8TR attributes and parameters. Explore more RF/Microwave Mixers devices from Analog Devices

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Conversion Loss:

11 dB

Maximum Input Power (CW):

13 dBm

JESD-609 Code:

e0

Mounting Feature:

No. of Terminals:

8

Maximum Operating Frequency:

1300 MHz

Minimum Operating Frequency:

600 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

TSSOP8,.19

Power Supplies (V):

3

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Mixers

Technology:

Terminal Finish:

TIN LEAD

Trade Compliance

HMC423MS8TR RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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