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HMC322LP4E

Analog Devices

HMC322LP4E by Analog Devices

Analog Devices' HMC322LP4E is a GAAS SP8T RF switch with 2.9 dB max insertion loss, 20 dB min isolation, and 8000 MHz max operating frequency. Ideal for RF/microwave applications, it offers -40 to 85 °C temp range and matte tin terminal finish for high-performance switching needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,851 parts In-Stock

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6,851

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Digiode

USA . 729 parts In-Stock

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729

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Parana Technologies

USA . 3,522 parts In-Stock

1+ parts

$2.317

100+ parts

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$2.154

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3,522

$2.317

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$2.154

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IDEA Electronic Components Group

UK . 858 parts In-Stock

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$2.491

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$2.366

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858

$2.491

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DigiPath Technology Company

USA . 822 parts In-Stock

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$3.886

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$3.731

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822

$3.886

$3.731

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Semicontronic

India . 150 parts In-Stock

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$13.000

100+ parts

$12.675

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$12.610

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150

$13.000

$12.675

$12.610

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AZTECH Wire

Italy . 319 parts In-Stock

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$18.750

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319

$18.750

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One Stop Electronics

USA . 1,008 parts In-Stock

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$27.000

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$27.000

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Component Stockers USA

USA . 504 parts In-Stock

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$99.990

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504

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,799 parts In-Stock

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Corphita

USA . 290 parts In-Stock

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Perfect Parts

USA . 166 parts In-Stock

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Overview

Elevate your RF/Microwave switch game with the HMC322LP4E by Analog Devices. With a reputation for quality and reliability, Analog Devices delivers top-notch components for a wide range of applications. This SP8T switch offers low insertion loss, high isolation, and impressive power handling capabilities, making it a valuable asset for any project. Whether you're in telecommunications, aerospace, or defense, the HMC322LP4E provides the performance and durability you need to stay ahead of the competition. Upgrade your system today and experience the difference Analog Devices can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material provides durability and protection for the internal components of the switch.

Maximum Input Power (CW): 26.02 dBm

With a high maximum input power capacity, this switch can handle strong signals without distortion or damage.

Compression Point (1 dB): 23 dBm

The high compression point ensures minimal signal distortion even at high power levels.

Power Supplies (V): -5

The low power supply voltage requirement makes this switch energy-efficient and suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: GAAS

The GaAs technology used in this switch offers high performance and reliability in RF/microwave applications.

Minimum Isolation: 20 dB

The high level of isolation ensures minimal interference between different ports of the switch.

Technical Specifications

RF/Microwave Switches HMC322LP4E attributes and parameters. Explore more RF/Microwave Switches devices from Analog Devices

Specs

Compression Point (1 dB):

23 dBm

Additional Features:

HIGH ISOLATION

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

26.02 dBm

Maximum Insertion Loss:

2.9 dB

Minimum Isolation:

20 dB

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

24

Nominal On Time:

.15 us

Maximum Operating Frequency:

8000 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC24,.16SQ,20

Port Termination:

ABSORPTIVE

Power Supplies (V):

-5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Terminal Finish:

Matte Tin (Sn)

Trade Compliance

HMC322LP4E RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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