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HMC1190LP6GE

Analog Devices

HMC1190LP6GE by Analog Devices

Analog Devices' HMC1190LP6GE is a 40-terminal chip carrier with a nominal voltage of 5V, operating b/w -40 to 85°C. This industrial-grade IC is surface-mountable and features matte tin terminal finish, suitable for various analog circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,342 parts In-Stock

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5,342

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Digiode

USA . 346 parts In-Stock

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346

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,445 parts In-Stock

1+ parts

$0.500

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1,445

$0.500

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One Stop Electronics

USA . 825 parts In-Stock

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$0.500

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825

$0.500

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Semicontronic

India . 676 parts In-Stock

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$4.500

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$4.388

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$4.365

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676

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 424 parts In-Stock

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$7.876

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424

$7.876

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Parana Technologies

USA . 1,599 parts In-Stock

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$14.709

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$13.679

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1,599

$14.709

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$13.679

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IDEA Electronic Components Group

UK . 1,578 parts In-Stock

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$15.816

100+ parts

$15.025

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$15.025

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1,578

$15.816

$15.025

$15.025

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DigiPath Technology Company

USA . 234 parts In-Stock

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$24.673

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$23.686

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$23.686

234

$24.673

$23.686

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$23.686

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RC Electronics

USA . 3,385 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 945 parts In-Stock

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945

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Perfect Parts

USA . 102 parts In-Stock

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Overview

Discover the cutting-edge HMC1190LP6GE by Analog Devices, a high-quality semiconductor offering unparalleled performance and reliability. With a wide range of applications in various industries, this product provides exceptional value to customers seeking top-of-the-line solutions. Analog Devices' reputation for excellence ensures that you are investing in a product that delivers superior results, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product resistant to damage and suitable for a variety of applications.

Surface Mount: YES

Surface mount packaging allows for easier and more compact integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage ensures compatibility with many existing systems and reduces the need for additional power conversion.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged usage without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in both extreme cold and hot environments.

Technical Specifications

Other Function Semiconductors HMC1190LP6GE attributes and parameters. Explore more Other Function Semiconductors devices from Analog Devices

Specs

Additional Features:

ALSO REQUIRED GATE VOLTAGES OF 4.5V TO 5.2V AND 3.1V TO 3.5V SUPPLY

Other IC type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.2 V

Minimum Supply Voltage (Vsup):

4.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

6 mm

Trade Compliance

HMC1190LP6GE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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