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ADUCRF101BCPZ128

Analog Devices

ADUCRF101BCPZ128 by Analog Devices

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$9.280

Lifecycle Status

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8

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1k+

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Chip1Stop

Japan . 7 parts In-Stock

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$6.720

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-

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7

$6.720

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Analog Devices Inc

USA . 298 parts In-Stock

1+ parts

$11.810

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-

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$5.400

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298

$11.810

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$5.400

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DigiKey

USA . 93 parts In-Stock

1+ parts

$11.870

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$9.074

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$8.232

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$7.976

93

$11.870

$9.074

$8.232

$7.976

Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$11.870

100+ parts

$8.580

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$7.650

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24

$11.870

$8.580

$7.650

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Rochester

USA . 726 parts In-Stock

1+ parts

-

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$6.750

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$6.040

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$5.680

726

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$5.680

Verical

USA . 276 parts In-Stock

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$6.642

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276

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Digiode

USA . 305 parts In-Stock

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$6.384

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Vyrian

USA . 8,578 parts In-Stock

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Ampacity Inc.

Singapore . 238 parts In-Stock

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$5.710

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$5.710

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Semicontronic

India . 238 parts In-Stock

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$5.710

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$5.567

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$5.539

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238

$5.710

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$5.539

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Corphita

USA . 51 parts In-Stock

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$6.048

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Native Components

USA . 906 parts In-Stock

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$41.419

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$39.762

906

$41.419

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Parana Technologies

USA . 1,714 parts In-Stock

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$44.622

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$41.499

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$44.622

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Northwest PG Solutions

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$45.561

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

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$47.981

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$45.582

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DigiPath Technology Company

USA . 1,314 parts In-Stock

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$74.850

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$71.856

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$71.856

1,314

$74.850

$71.856

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$71.856

Component Stockers USA

USA . 492 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Perfect Parts

USA . 82 parts In-Stock

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82

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Technical Specifications

Microcontrollers ADUCRF101BCPZ128 attributes and parameters. Explore more Microcontrollers devices from Analog Devices

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SERIAL WIRE, SPI, UART

Peripherals:

DMA(14), POR, PWM(8), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

ADUCRF101BCPZ128 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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