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ADSST-MEL-100

Analog Devices

ADSST-MEL-100 by Analog Devices

ADSST-MEL-100 by Analog Devices is a consumer IC with 225 terminals in a square package. It operates b/w 0 to 85 °C, with power supplies of 1.8V and 3.3V. This CMOS technology device is ideal for applications requiring low profile grid array packages and surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,978 parts In-Stock

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Digiode

USA . 819 parts In-Stock

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819

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Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$3.080

100+ parts

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$2.865

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2,317

$3.080

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$2.865

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IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$3.312

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$3.146

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768

$3.312

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$3.146

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DigiPath Technology Company

USA . 2,331 parts In-Stock

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$5.167

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$4.960

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$4.960

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One Stop Electronics

USA . 256 parts In-Stock

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$13.800

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256

$13.800

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Semicontronic

India . 993 parts In-Stock

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$16.800

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$16.380

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$16.296

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993

$16.800

$16.380

$16.296

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Native Components

USA . 606 parts In-Stock

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$17.620

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606

$17.620

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AZTECH Wire

Italy . 647 parts In-Stock

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$17.966

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Northwest PG Solutions

USA . 478 parts In-Stock

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$19.382

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$17.444

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Assy Fe

Spain . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 600 parts In-Stock

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600

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Corphita

USA . 345 parts In-Stock

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Overview

Unlock the ultimate performance with the ADSST-MEL-100 by Analog Devices, a top-quality consumer IC that promises unrivaled reliability and precision. Designed with cutting-edge technology and a sleek package body material, this innovative product boasts a multitude of applications to suit your needs. Say goodbye to limitations and hello to endless possibilities with the ADSST-MEL-100 - experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in consumer ICs for its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits.

Package Shape: SQUARE

The square shape helps in optimizing space utilization on circuit boards.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages enhances compatibility with various systems.

No. of Terminals: 225

A higher number of terminals provides greater connectivity and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile design helps in achieving a compact form factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance under varying environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments.

Terminal Finish: TIN LEAD

Tin-lead finish offers good solderability and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position simplifies the soldering and mounting process.

Maximum Seated Height: 1.7 mm

Low profile design with a maximum seated height of 1.7 mm aids in compact device designs.

Width: 17 mm

A compact width of 17 mm contributes to space-saving on the circuit board.

Minimum Supply Voltage (Vsup): 1.71 V

Support for a low minimum supply voltage enables operation in low-power applications.

Length: 17 mm

A square shape with a length of 17 mm helps in achieving a balanced design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and ease of mounting.

Terminal Pitch: 1 mm

A tight terminal pitch of 1 mm allows for a high-density layout of components.

Maximum Supply Voltage (Vsup): 1.89 V

Support for a maximum supply voltage of 1.89 V ensures safe operation within specified limits.

Technical Specifications

Other Function Consumer ICs ADSST-MEL-100 attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B225

JESD-609 Code:

e0

Length:

17 mm

No. of Functions:

1

No. of Terminals:

225

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

ADSST-MEL-100 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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