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ADSP-BF535PBB-200

Analog Devices

ADSP-BF535PBB-200 by Analog Devices

ADSP-BF535PBB-200 by Analog Devices is a 32-bit DSP with 26-bit address bus, operating at max 40 MHz. It's used in industrial applications due to its low power mode, barrel shifter feature, and wide supply voltage range of 0.95V to 1.575V.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Vyrian

USA . 4,069 parts In-Stock

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Digiode

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Native Components

USA . 123 parts In-Stock

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$1.273

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Northwest PG Solutions

USA . 1,147 parts In-Stock

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AZTECH Wire

Italy . 482 parts In-Stock

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Semicontronic

India . 1,618 parts In-Stock

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Corohmni

South Africa . 2,462 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 850 parts In-Stock

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IDEA Electronic Components Group

UK . 257 parts In-Stock

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DigiPath Technology Company

USA . 51 parts In-Stock

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Vigor

Singapore . 2,408 parts In-Stock

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RC Electronics

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the ADSP-BF535PBB-200 from Analog Devices. As a leader in digital signal processors (DSPs), Analog Devices delivers top-quality products that exceed expectations. With a wide range of applications, this DSP offers unparalleled performance and efficiency. From industrial automation to consumer electronics, the ADSP-BF535PBB-200 provides value and innovation that sets it apart from the competition. Upgrade your projects with reliability and precision, thanks to Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good thermal resistance and is cost-effective, making the product durable and affordable.

Surface Mount: YES

Surface mount provides easier and more efficient assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.575 V

Operating at a maximum supply voltage of 1.575 V ensures power efficiency and helps in reducing energy consumption.

Address Bus Width: 26

A wider address bus width of 26 allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

Square package shape enables easy placement and routing on circuit boards, optimizing space utilization.

Bit Size: 32

Having a larger bit size of 32 enables higher precision and accuracy in digital signal processing tasks.

Power Supplies (V): 1.5,3.3

Multiple power supply options of 1.5V and 3.3V offer flexibility in design and compatibility with various system requirements.

No. of Terminals: 260

Having 260 terminals allows for connectivity with other components and peripherals, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY

Grid array package style provides improved thermal performance and reliability in demanding industrial applications.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95 V ensures low power consumption and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN LEAD SILVER

TIN LEAD SILVER terminal finish offers good solderability and conductivity, enhancing the product's overall reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the assembly process.

Maximum Seated Height: 2.5 mm

With a maximum seated height of 2.5 mm, the product can be easily accommodated in space-constrained designs.

Width: 19 mm

With a width of 19 mm, the product is compact and can fit into small form factor devices.

Boundary Scan: YES

Boundary scan capability allows for easy testing and diagnosis of the product during manufacturing and maintenance processes.

External Data Bus Width: 32

Having an external data bus width of 32 enables high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40 MHz ensures fast and efficient signal processing performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and computational efficiency of the DSP.

Length: 19 mm

A length of 19 mm allows for compact placement on PCBs and facilitates efficient signal routing.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the product can operate reliably in rugged environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports various peripheral IC types, enhancing the product's compatibility with a wide range of applications and devices.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the product energy-efficient and cost-effective.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and enables easy soldering during assembly.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5 V ensures stable and consistent performance in various operating conditions.

Terminal Pitch: 1 mm

Having a terminal pitch of 1 mm allows for high-density mounting on PCBs, optimizing space utilization.

Format: FIXED POINT

Fixed-point format allows for efficient mathematical operations and precise calculations in digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture and humidity, ensuring long-term reliability in diverse environmental conditions.

Speed: 200 rpm

With a speed of 200 rpm, the product delivers fast and responsive signal processing performance in real-time applications.

Low Power Mode: YES

Low power mode option enhances energy efficiency and extends battery life, making the product suitable for portable and IoT devices.

Barrel Shifter: YES

Barrel shifter capability enables efficient shifting and rotating operations in data processing tasks, improving computational efficiency.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF535PBB-200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

26

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B260

JESD-609 Code:

e0

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

260

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA260,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Speed:

200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.575 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF535PBB-200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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