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ADPD107BCBZR7

Analog Devices

ADPD107BCBZR7 by Analog Devices

ADPD107BCBZR7 by Analog Devices is a consumer IC with 17 terminals in a grid array package. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.7V to 1.9V. This IC is ideal for industrial applications requiring precise circuit control and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,652 parts In-Stock

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Digiode

USA . 194 parts In-Stock

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Parana Technologies

USA . 1,703 parts In-Stock

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$2.571

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$2.391

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$2.571

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$2.391

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

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$2.764

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$2.626

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$2.764

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$2.626

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One Stop Electronics

USA . 1,296 parts In-Stock

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$3.800

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$3.800

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DigiPath Technology Company

USA . 87 parts In-Stock

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$4.312

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$4.139

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87

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$4.139

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Vigor

Singapore . 473 parts In-Stock

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$5.970

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473

$5.970

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AZTECH Wire

Italy . 596 parts In-Stock

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$7.511

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$7.511

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Native Components

USA . 457 parts In-Stock

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$14.133

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Semicontronic

India . 599 parts In-Stock

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$14.800

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$14.430

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$14.356

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$14.356

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Northwest PG Solutions

USA . 1,808 parts In-Stock

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$15.546

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$13.992

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$13.992

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Perfect Parts

USA . 6,720 parts In-Stock

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Microchip USA

USA . 953 parts In-Stock

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Corphita

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Overview

Discover the ultimate solution for your consumer circuit needs with Analog Devices' ADPD107BCBZR7. This high-quality IC offers unparalleled performance and reliability, making it perfect for a wide range of applications. Whether you're designing wearable devices, health monitors, or smart home technology, this product delivers exceptional value, benefits, and advantages to meet all your requirements. Trust Analog Devices to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a good balance between durability and cost-effectiveness.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board.

General IC Type: CONSUMER CIRCUIT

The consumer circuit type is suitable for various consumer electronics applications, making the product versatile.

No. of Terminals: 17

Having 17 terminals allows for more connectivity options, increasing the functionality of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile and fine pitch offers high performance and compact design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability in cold environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the soldering process and improves the aesthetics of the product.

Maximum Seated Height: 0.56 mm

With a low maximum seated height, the product can be used in slim devices.

Width: 1.4 mm

The narrow width allows for efficient use of space on a circuit board.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage makes the product suitable for low power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperature for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for efficient soldering processes.

Length: 2.46 mm

The compact length contributes to the overall space-saving design of the product.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures makes the product suitable for a wide range of applications.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and ease of soldering.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high connectivity density in a small space.

Maximum Supply Voltage (Vsup): 1.9 V

With a low maximum supply voltage, the product is suitable for low power consumption applications.

Technical Specifications

Other Function Consumer ICs ADPD107BCBZR7 attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B17

JESD-609 Code:

e1

Length:

2.46 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

17

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.56 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.4 mm

Trade Compliance

ADPD107BCBZR7 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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