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ADMV4801BCCZ

Analog Devices

ADMV4801BCCZ by Analog Devices

ADMV4801BCCZ by Analog Devices is a surface mount telecom IC with 72 terminals in a square package. It operates b/w -40°C to 85°C and has a peak reflow temperature of 260°C. This IC is suitable for telecom circuit applications.

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4

In-Stock Inventory

1k+

ADMV4801BCCZ by Analog Devices
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Vyrian

USA . 12,136 parts In-Stock

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Digiode

USA . 502 parts In-Stock

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VNN

France . 450 parts In-Stock

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450

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Parana Technologies

USA . 199 parts In-Stock

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$10.999

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$10.229

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199

$10.999

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$10.229

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IDEA Electronic Components Group

UK . 297 parts In-Stock

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$11.827

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$11.236

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$11.236

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297

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$11.236

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AZTECH Wire

Italy . 381 parts In-Stock

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$14.858

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Aztec Data Supply Inc.

USA . 22,118 parts In-Stock

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$15.080

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Corohmni

South Africa . 11 parts In-Stock

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$17.565

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DigiPath Technology Company

USA . 702 parts In-Stock

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$18.450

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$17.712

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$17.712

702

$18.450

$17.712

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$17.712

Semicontronic

India . 804 parts In-Stock

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$319.000

100+ parts

$311.025

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$309.430

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804

$319.000

$311.025

$309.430

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One Stop Electronics

USA . 1,396 parts In-Stock

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$683.000

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Ampacity Inc.

Singapore . 735 parts In-Stock

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$815.000

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$815.000

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Continental Prestige Electronics

USA . 4,488 parts In-Stock

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Argo Parts USA

USA . 2,458 parts In-Stock

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Corphita

USA . 170 parts In-Stock

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170

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Discover the ADMV4801BCCZ by Analog Devices, a game-changing telecom interface IC that delivers unrivaled quality and performance. As a trusted manufacturer with years of experience, Analog Devices ensures reliability and excellence in every product. This versatile IC finds its applications in various telecom circuits, making it an essential component for seamless communication. With its innovative design and cutting-edge technology, the ADMV4801BCCZ offers customers unmatched value, benefits, and advantages - simplifying installations, enhancing connectivity, and revolutionizing telecom experiences. Experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

This product being surface mount compatible enables easy and efficient installation onto PCBs, making it a convenient choice for telecom interface applications.

Package Shape: SQUARE

The square package shape provides a compact design for this telecom interface IC, optimizing space utilization on circuit boards and improving overall system efficiency.

No. of Terminals: 72

With a substantial number of terminals, this telecom interface IC allows for the connection of multiple components, enhancing its versatility and suitability for complex telecom applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers a higher density of terminals, facilitating a higher level of integration and allowing for better signal routing, making it an excellent choice for telecom interface functions.

Maximum Operating Temperature: 85 °C

This product's high maximum operating temperature capability ensures reliable performance even in harsh environments, making it highly reliable for telecom interface applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of this IC ensures its suitability for a wide range of application environments, including those with colder temperatures, making it a versatile choice.

Terminal Position: BOTTOM

The bottom terminal position of this IC simplifies board layout and ensures easy and precise connection, enhancing the convenience of its integration into telecom interface systems.

Maximum Time At Peak Reflow Temperature (s): 30

This product's maximum time at peak reflow temperature specification ensures efficient soldering during assembly processes, making it a reliable and time-saving choice.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of this IC enables it to withstand the soldering process without any performance degradation, ensuring excellent manufacturing reliability.

Terminal Form: NO LEAD

The no-lead terminal form of this IC (e.g., leadless package or lead-free solder) aligns with modern environmental regulations and facilitates compatibility with RoHS-compliant systems, making it an eco-friendly choice.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuit applications, this IC offers optimal performance and functionality, making it a highly suitable and dependable choice for telecom interface systems.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating of this telecom IC indicates its resistance to moisture-induced failures during storage and assembly processes, contributing to its durability and reliability in demanding telecom environments.

Technical Specifications

Other Function Telecom Interface ICs ADMV4801BCCZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XBGA-N72

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ADMV4801BCCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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