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ADMP401-1ACEZ-RL7

Analog Devices

ADMP401-1ACEZ-RL7 by Analog Devices

ADMP401-1ACEZ-RL7 by Analog Devices is a consumer IC with 6 terminals, operating b/w -40 to 85 °C. It has a thin profile grid array package, suitable for industrial applications. With a supply voltage range of 1.5V to 3.6V, it is ideal for compact electronic devices requiring precise audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,444 parts In-Stock

1+ parts

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8,444

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Digiode

USA . 707 parts In-Stock

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,442 parts In-Stock

1+ parts

$2.180

100+ parts

-

1k+ parts

$2.027

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4,442

$2.180

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$2.027

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IDEA Electronic Components Group

UK . 435 parts In-Stock

1+ parts

$2.344

100+ parts

-

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$2.227

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435

$2.344

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$2.227

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DigiPath Technology Company

USA . 502 parts In-Stock

1+ parts

$3.657

100+ parts

$3.510

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-

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502

$3.657

$3.510

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One Stop Electronics

USA . 920 parts In-Stock

1+ parts

$9.800

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920

$9.800

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AZTECH Wire

Italy . 822 parts In-Stock

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$15.234

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822

$15.234

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Semicontronic

India . 842 parts In-Stock

1+ parts

$19.800

100+ parts

$19.305

1k+ parts

$19.206

10k+ parts

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842

$19.800

$19.305

$19.206

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Native Components

USA . 943 parts In-Stock

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943

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Northwest PG Solutions

USA . 767 parts In-Stock

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767

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Corphita

USA . 658 parts In-Stock

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658

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Overview

Enhance your audio experience with the ADMP401-1ACEZ-RL7 by Analog Devices, a top-quality consumer IC that delivers superior performance and reliability. Manufactured by Analog Devices, a trusted name in the industry, this product is designed for a wide range of applications, ensuring clear and crisp sound in every use. With a compact package shape and surface mount design, this IC offers easy installation and seamless integration into any device. Trust Analog Devices to provide you with the best in audio technology, delivering value, benefits, and advantages that will elevate your audio experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, providing a reliable housing for the IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate this IC into various electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and reliability.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this IC suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures enhances the versatility of this IC.

Terminal Position: BOTTOM

Bottom terminal position simplifies the connection process for the IC.

Width: 3.76 mm

Compact width allows for space-saving integration in electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

Low minimum supply voltage enables efficient power consumption in the circuit.

Length: 4.72 mm

The small length of the IC makes it suitable for compact electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments.

Terminal Form: BALL

Ball terminal form provides strong contact points for stable connections.

Terminal Pitch: 1.2 mm

Close terminal pitch allows for high-density mounting on circuit boards.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage provides flexibility in power input options for the IC.

Technical Specifications

Other Function Consumer ICs ADMP401-1ACEZ-RL7 attributes and parameters. Explore more Other Function Consumer ICs devices from Analog Devices

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B6

Length:

4.72 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

BOTTOM

Width:

3.76 mm

Trade Compliance

ADMP401-1ACEZ-RL7 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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