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224-1275-29-0602J

3m Electronic Products Division

224-1275-29-0602J by 3m Electronic Products Division

The 3M Electronic Products Division's 224-1275-29-0602J is a DIP24 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 24 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier IC applications requiring a secure and durable socket solution.

Median Price

$16.726

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 6 parts In-Stock

1+ parts

$5.682

100+ parts

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6

$5.682

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DigiKey

USA . 39 parts In-Stock

1+ parts

$27.770

100+ parts

$20.062

1k+ parts

$17.924

10k+ parts

-

39

$27.770

$20.062

$17.924

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

R&J Components

USA . 11 parts In-Stock

1+ parts

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11

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Perfect Parts

USA . 83 parts In-Stock

1+ parts

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83

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Upgrade your electronics with the 224-1275-29-0602J by 3M Electronic Products Division. Crafted with high-quality materials and precision engineering, this chip carrier IC & component socket offers unparalleled performance and reliability. Perfect for DIP24 devices, this IC socket features beryllium copper contacts with a gold finish for optimal conductivity. Trust in 3M's reputation for excellence and experience seamless connections with the 224-1275-29-0602J. Whether you're a professional technician or a DIY enthusiast, this product is sure to enhance your projects with its superior quality and design. Elevate your electronics game today!

Feature Benefit Bullets

Housing Material: GLASS FILLED POLYSULFONE

Glass filled polysulfone provides high strength and durability to the chip carrier socket, ensuring a reliable and long-lasting performance.

Device Type Used On: DIP24

Designed specifically for DIP24 devices, ensuring a perfect fit and compatibility.

Contact Material: BERYLLIUM COPPER

Beryllium copper contacts offer excellent conductivity and corrosion resistance, ensuring a stable connection for the IC.

No. of Contacts: 24

With 24 contacts, this chip carrier socket can accommodate a wide range of ICs and provide multiple connection points for enhanced performance.

Contact Finish (Mating): GOLD (30) OVER NICKEL (50)

Gold over nickel finish on mating contacts provides superior conductivity and prevents oxidation, resulting in reliable signal transmission.

Contact Finish (Termination): GOLD (30) OVER NICKEL (50)

Similar to mating contacts, gold over nickel finish on termination contacts ensures a durable and reliable connection for the IC.

IC Socket Type: IC SOCKET

Specifically designed as an IC socket, this product is tailored for secure and precise installation of integrated circuits.

Technical Specifications

Chip Carrier IC & Component Sockets 224-1275-29-0602J attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from 3m Electronic Products Division

Connectivity

Number of Positions or Pins:

24

Contact Finish - Mating:

Gold (30) over Nickel (50)

Contact Finish - Termination:

Gold (30) over Nickel (50)

Contact Material:

Beryllium Copper

Physical Characteristics

IC Socket Type:

Housing Material:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

Standard: UL 94V-0

Trade Compliance

224-1275-29-0602J Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

3m Electronic Products Division

With over 60,000 products in our portfolio, 3M brands deliver science-based performance and extraordinary outcomes across almost any industry you can imagine.

Category top products 20

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