Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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NP40N10PDF-E1-AY
Renesas Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Transistor Element Material: SILICON; Additional Features: LOGIC LEVEL COMPATIBLE;
LOGIC LEVEL COMPATIBLE
61 mJ
DRAIN
SINGLE WITH BUILT-IN DIODE
100 V
40 A
.038 ohm
METAL-OXIDE SEMICONDUCTOR
TO-263AB
R-PSSO-G2
1
2
ENHANCEMENT MODE
175 Cel
PLASTIC/EPOXY
RECTANGULAR
SMALL OUTLINE
NOT SPECIFIED
N-CHANNEL
1.8 W
80 A
Not Qualified
FET General Purpose Powers
YES
GULL WING
SINGLE
SWITCHING
SILICON
UPA2379T1P-E1-A
N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Terminal Finish: TIN BISMUTH; Maximum Operating Temperature: 150 Cel; Maximum Drain Current (Abs) (ID): 8 A;
8 A
e6
150 Cel
FET General Purpose Power
TIN BISMUTH
BSP373L6327HTSA1
Infineon Technologies
Infineon's BSP373L6327HTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage and 6.8A IDM, suitable for power applications. It features a built-in diode, operates in enhancement mode, and has a max power dissipation of 1.8W. Ideal for small outline packages in automotive electronics due to AEC-Q101 compliance.
AVALANCHE RATED
45 mJ
1.7 A
.3 ohm
105 pF
R-PDSO-G4
e3
4
-55 Cel
6.8 A
AEC-Q101
MATTE TIN
DUAL
195 ns
60 ns
DMP1018UCB9-7
Diodes Incorporated
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; No. of Elements: 1; Terminal Finish: TIN SILVER COPPER;
12 V
7.6 A
5.5 A
.022 ohm
120 pF
S-PBGA-B9
e1
9
SQUARE
GRID ARRAY
260
P-CHANNEL
60 A
Other Transistors
TIN SILVER COPPER
BALL
BOTTOM
30
BSP324L6327HTSA1
Infineon's BSP324L6327HTSA1 is a N-CHANNEL FET with 400V DS breakdown voltage, ideal for switching applications. It features a built-in diode, 25 ohm RDS(on), and operates in enhancement mode. With AEC-Q101 standard compliance, it offers fast turn-on/off times and low feedback capacitance for efficient performance in automotive electronics.
400 V
.17 A
25 ohm
5.7 pF
.68 A
127 ns
13.5 ns
BSP613P
BSP613P by Infineon Technologies is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a max pulsed drain current of 11.6A and an avalanche energy rating of 150mJ. With a 0.13 ohm max drain-source resistance, this MOSFET operates in enhancement mode at up to 150°C, making it suitable for high-power applications.
150 mJ
60 V
2.9 A
.13 ohm
11.6 A
TIN
SPN02N60S5
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Case Connection: DRAIN; JESD-30 Code: R-PDSO-G4;
HIGH VOLTAGE
50 mJ
600 V
.4 A
3 ohm
e0
255
2.2 A
TIN LEAD
SPN03N60S5
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Maximum Operating Temperature: 150 Cel; Maximum Drain Current (ID): .7 A;
100 mJ
.7 A
1.4 ohm
3
3 A
BSP129L6327
BSP129L6327 by Infineon Technologies is a N-CHANNEL Power FET with PLASTIC/EPOXY package. It has a Min DS Breakdown Voltage of 240V and Max Drain Current of 0.35A, making it suitable for applications requiring high power dissipation in small outline packages. Ideal for depletion mode operation at up to 150°C, this FET offers low drain-source resistance of 6 ohm for efficient performance.
240 V
.35 A
6 ohm
DEPLETION MODE
1.4 A
BUK98150-55,135
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Case Connection: DRAIN; Maximum Drain-Source On Resistance: .15 ohm;
LOGIC LEVEL COMPATIBLE, ESD PROTECTED
15 mJ
55 V
2.6 A
.15 ohm
30 A
SPN04N60S5
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Package Shape: RECTANGULAR; Minimum DS Breakdown Voltage: 600 V;
.8 A
.95 ohm
TO-261AA
BSP615S2L
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Terminal Form: GULL WING;
2.8 A
11 A
SPN01N60C3
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Package Body Material: PLASTIC/EPOXY; Moisture Sensitivity Level (MSL): 1;
.3 A
1.6 A
SPN03N60C3
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; JEDEC-95 Code: TO-261AA; Package Style (Meter): SMALL OUTLINE;
NTQD6968NR2G
Onsemi
NTQD6968NR2G by Onsemi is a N-CHANNEL FET with 20V DS Breakdown Voltage, 18A IDM, and 0.03 ohm RDS(on). Commonly used for SWITCHING applications due to its COMMON DRAIN configuration. It comes in a small outline package with GULL WING terminals.
COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
20 V
7 A
6.2 A
.03 ohm
R-PDSO-G8
8
18 A
DMT10H072LFDFQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; JESD-30 Code: S-PDSO-N6; Terminal Finish: NICKEL PALLADIUM GOLD;
1.8 mJ
4 A
.062 ohm
2.5 pF
S-PDSO-N6
e4
6
22 A
AEC-Q101; IATF 16949; MIL-STD-202
NICKEL PALLADIUM GOLD
NO LEAD
BSP322PL6327HTSA1
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Maximum Pulsed Drain Current (IDM): 4 A; Maximum Operating Temperature: 150 Cel;
57 mJ
1 A
.8 ohm
51 pF
44.3 ns
13.4 ns
DMP6110SVT-13
DMP6110SVT-13 by Diodes Inc. is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 24A IDM, 18mJ EAS, and 0.105 ohm RDS(ON). With a small outline package and -55 to 150 °C operating range, it's suitable for various power management designs.
18 mJ
7.3 A
.105 ohm
44 pF
R-PDSO-G6
24 A
DMC3025LNS-13
N-CHANNEL AND P-CHANNEL; Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Maximum Feedback Capacitance (Crss): 57 pF; JESD-609 Code: e3;
9.8 mJ
30 V
7.2 A
.035 ohm
57 pF
S-PDSO-F8
N-CHANNEL AND P-CHANNEL
45 A
MIL-STD-202
FLAT
BSP179H6327XTSA1
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Minimum DS Breakdown Voltage: 400 V; Maximum Turn Off Time (toff): 127 ns;
.21 A
18 ohm
9 pF
.83 A
AEC-Q100; IEC-61249-2-21
22.3 ns
DMT10H072LFDF-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Package Body Material: PLASTIC/EPOXY; Maximum Time At Peak Reflow Temperature (s): 30;
DMT3006LDV-13
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Maximum Drain Current (ID): 25 A; Moisture Sensitivity Level (MSL): 1;
58 mJ
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
25 A
.01 ohm
72 pF
S-PDSO-F6
90 A
DMT3006LDV-7
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.8 W; Terminal Position: DUAL; Avalanche Energy Rating (EAS): 58 mJ;
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