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Part# Info Device Specifications Physical Specifications Material and Finish Thermal Specifications Usage and Compatibility
Part RoHS Manufacturer Description Construction Profile Fin Orientation Packing Method Additional Features Standards Height Width Length Diameter Weight Finish Body Material Composition Color Thermal Resistance Rated Power Device Type Compatible Device
904-27-1-23-2-B-0 by Wakefield Thermal Solutions

904-27-1-23-2-B-0

Wakefield Thermal Solutions

Wakefield Thermal Solutions' 904-27-1-23-2-B-0 heat sink has thermal resistance of 12.93 ohm, elliptical fin orientation, and black anodized finish. It is a clip-profile extruded aluminum alloy device used on ICs for efficient heat dissipation.

Extruded

Clip

Elliptical Fin

0.906 in (23 mm)

1.063 in (27 mm)

1.063 in (27 mm)

Black Anodized

Aluminium Alloy

12.93 Ω

Heat Sink

IC

910-40-1-23-2-B-0 by Wakefield Thermal Solutions

910-40-1-23-2-B-0

Wakefield Thermal Solutions

910-40-1-23-2-B-0 by Wakefield Thermal Solutions is a heat sink with thermal resistance of 9.95 ohm, elliptical fin orientation, and black anodized finish. It is an extruded aluminum alloy device used on ICs for efficient heat dissipation in electronic applications.

Extruded

Clip

Elliptical Fin

0.906 in (23 mm)

1.575 in (40 mm)

1.575 in (40 mm)

Black Anodized

Aluminium Alloy

9.95 Ω

Heat Sink

IC