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BALL Digital Transmission Controllers 30

Digital Transmission Controllers
Part# Info Specs
Part RoHS Manufacturer Description Carrier Type-1 Carrier Type-2 Data Rate ISDN Access Rate JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
DS26401NA2 by Maxim Integrated

DS26401NA2

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

17 mm

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

1.75 mm

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

17 mm

DS33R11 by Maxim Integrated

DS33R11

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

27 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

Not Qualified

2.54 mm

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

DS26522GN by Maxim Integrated

DS26522GN

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B144

e1

13 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA144,12X12,40

SQUARE

GRID ARRAY

245

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.22 mA

3.3 V

YES

TIME SLOT 0/16 TRANSCEIVER

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

13 mm

DS26522G by Maxim Integrated

DS26522G

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B144

13 mm

3

1

144

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA144,12X12,40

SQUARE

GRID ARRAY

3.3

Not Qualified

1.75 mm

Other Telecom ICs

.22 mA

3.3 V

YES

TIME SLOT 0/16 TRANSCEIVER

COMMERCIAL

BALL

1 mm

BOTTOM

13 mm

DS26524GN by Maxim Integrated

DS26524GN

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B256

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

3.3

Not Qualified

1.76 mm

Other Telecom ICs

.45 mA

3.3 V

YES

BIPOLAR

TIME SLOT 0/16 TRANSCEIVER

INDUSTRIAL

BALL

1 mm

BOTTOM

17 mm

DS26519GN by Maxim Integrated

DS26519GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

S-PBGA-B484

e0

23 mm

3

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

245

1.8,3.3

Not Qualified

2.41 mm

Other Telecom ICs

.925 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

23 mm

DS26524G by Maxim Integrated

DS26524G

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B256

e0

17 mm

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

3.3

Not Qualified

1.76 mm

Other Telecom ICs

.45 mA

3.3 V

YES

BIPOLAR

TIME SLOT 0/16 TRANSCEIVER

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

DS3112D1 by Maxim Integrated

DS3112D1

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

27 mm

3

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

2.34 mm

3.3 V

YES

CMOS

FRAMER

COMMERCIAL

BALL

1.27 mm

BOTTOM

27 mm

DS2155GB by Maxim Integrated

DS2155GB

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

1

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

COMMERCIAL

BALL

.8 mm

BOTTOM

10 mm

DS2155GNB by Maxim Integrated

DS2155GNB

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

1

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

.8 mm

BOTTOM

10 mm

DS2155GNC2 by Maxim Integrated

DS2155GNC2

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

10 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

.8 mm

BOTTOM

10 mm

DS34S101GN by Maxim Integrated

DS34S101GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e1

17 mm

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

225

1.8/3.3

Not Qualified

1.76 mm

Digital Transmission Interfaces

.28 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

DS34S102GN by Maxim Integrated

DS34S102GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

17 mm

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8/3.3

Not Qualified

1.76 mm

Digital Transmission Interfaces

.28 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

DS34S104GN by Maxim Integrated

DS34S104GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

17 mm

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8/3.3

Not Qualified

1.76 mm

Digital Transmission Interfaces

.28 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

DS34S108GN by Maxim Integrated

DS34S108GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e0

23 mm

3

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

245

1.8/3.3

Not Qualified

2.41 mm

Digital Transmission Interfaces

.28 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

23 mm

DS34T101GN by Maxim Integrated

DS34T101GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e0

23 mm

3

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

245

1.8/3.3

Not Qualified

2.41 mm

Digital Transmission Interfaces

.55 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

23 mm

DS34T102GN by Maxim Integrated

DS34T102GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e0

23 mm

3

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

245

1.8/3.3

Not Qualified

2.41 mm

Digital Transmission Interfaces

.55 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

23 mm

DS34T108GN by Maxim Integrated

DS34T108GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

23 mm

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

225

1.8/3.3

Not Qualified

2.41 mm

Digital Transmission Interfaces

.55 mA

1.8 V

YES

FRAMER

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

23 mm

DS26528GNA5 by Maxim Integrated

DS26528GNA5

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

1.76 mm

3.3 V

YES

FRAMER

INDUSTRIAL

BALL

1 mm

BOTTOM

17 mm

DS26528 by Maxim Integrated

DS26528

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE;

S-PBGA-B256

17 mm

3

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Not Qualified

1.76 mm

3.3 V

YES

FRAMER

COMMERCIAL

BALL

1 mm

BOTTOM

17 mm

DS3170N by Maxim Integrated

DS3170N

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

S-PBGA-B100

e0

11 mm

3

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.3

Not Qualified

1.5 mm

Other Telecom ICs

.145 mA

3.3 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

11 mm

DS3170 by Maxim Integrated

DS3170

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;

S-PBGA-B100

e0

11 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.3

Not Qualified

1.5 mm

Other Telecom ICs

.145 mA

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

11 mm

DS3172N by Maxim Integrated

DS3172N

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B400

e0

27 mm

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

3.3

Not Qualified

2.54 mm

Other Telecom ICs

.328 mA

3.3 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

DS3172 by Maxim Integrated

DS3172

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B400

e0

27 mm

1

400

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

3.3

Not Qualified

2.54 mm

Other Telecom ICs

.328 mA

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

DS3173 by Maxim Integrated

DS3173

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B400

e0

27 mm

1

400

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

3.3

Not Qualified

2.54 mm

Other Telecom ICs

.449 mA

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

DS26556 by Maxim Integrated

DS26556

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B256

17 mm

3

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

245

3.3

Not Qualified

1.76 mm

Other Telecom ICs

3.3 V

YES

FRAMER

COMMERCIAL

BALL

1 mm

BOTTOM

17 mm

DS34S132GN by Maxim Integrated

DS34S132GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: HBGA; Package Shape: SQUARE;

S-PBGA-B676

27 mm

1

676

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

NOT SPECIFIED

Not Qualified

2.41 mm

1.8 V

YES

FRAMER

INDUSTRIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

DS2156G by Maxim Integrated

DS2156G

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B100

e0

10 mm

3

1

100

70 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA100,10X10,32

SQUARE

GRID ARRAY, FINE PITCH

3.3

Not Qualified

Other Telecom ICs

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

.8 mm

BOTTOM

10 mm

DS26528GN by Maxim Integrated

DS26528GN

Maxim Integrated

FRAMER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B256

e0

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

3.3

Not Qualified

1.76 mm

Other Telecom ICs

.875 mA

3.3 V

YES

FRAMER

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm

DS26528G by Maxim Integrated

DS26528G

Maxim Integrated

FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

CEPT PCM-30/E-1

T-1(DS1)

S-PBGA-B256

e0

17 mm

3

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

3.3

Not Qualified

1.76 mm

Other Telecom ICs

.875 mA

3.3 V

YES

FRAMER

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

17 mm